Advanced Circuit Technology, Inc.

Davis W Murphy

Thomas H Stearns

Dennis A Bonnette

A method of forming a conductive network, having relatively flexible electrical conductor areas integral with relatively rigid electrically conductor areas including (a) providing a relatively rigid laminate having a dielectric lamina supporting, at least in part, a first electrically conductive lamina which is in electrically conductive intimate contact with a second electrically conductive lamina by way of an electrically conductive barrier layer, the first and second conductive laminae being of a material etchable by an etchant which is not an etchant for the barrier layer; (b) selectively etching desired portions of the aid second electrically conductive lamina to the barrier layer in at least the relatively flexible areas using the etchant; and (c) selectively etching desired exposed metallic portions of the laminate down to the dielectric lamina to form the conductive network using an etchant, the etchant chosen to etch both the conductive lamina and the barrier layer.

Method of forming printed circuits having multiple conductor thicknesses

A laminate comprising metal layers separated by an etchant barrier to control depth of etching of the laminate, the barrier being etchable by an etchant which is not an etchant for the layers. A cable incorporating such a laminate and having relatively flexible conductors integral with relatively rigid terminals. A method of making such a cable, using the laminate, by selectively etching the layers down to the barrier to form the conductors and terminals, stripping the barrier and laminating the conductor with an insulating material preferably extending over at least a portion of the terminals to reinforce the conductor terminal transition and a cable when made of such a method.

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Hudson, NH, United States of America

Davis W Murphy