General Electric Company

Sabic Global Technolgoies B.v.

Momentive Performance Materials Gmbh

Davide Louis Simone

David Alexander Gibson, Iii

Allen Lawrence Garner

Gary Stephen Balch

Gregory John Parker

Harold Jay Patchen

Larry Neil Lewis

Raymond Albert Fillion

Daniel Qi Tan

Francis Johnson

Thomas Martin Angeliu

Patrick Roland Lucien Malenfant

Jian Zhang

Sandeep Shrikant Tonapi

Pierre-Andre Bui

Walter Vladimir Cicha

Hong Zhong

Christopher Michael Carter

A composition for destructive interference in at least a portion of the frequency range from about 1 GHz to about 20 GHz can comprise a dielectric and a conductive filler mixed with at least a portion of the dielectric, wherein the percentage volume of the conductive filler relative to the total volume of the composition is configured such that the wavelength of sensitivity for the composition is on the order of a wavelength of an incident electromagnetic radiation in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Methods and compositions for destructive interference

A composition for energy dissipation in at least a portion of the frequency range from about 1 GHz to about 20 GHz, the composition can comprise a dielectric and graphene mixed with at least a portion of the dielectric, wherein the percentage volume of the graphene relative to the total volume of the composition is configured such that dissipation of incident electromagnetic radiation is substantially optimized in at least a portion of the frequency range from about 1 GHz to about 20 GHz.

Methods and compositions for energy dissipation

A composition includes a metal precursor. The metal precursor may include an inorganic ligand and a metal cation. The inorganic ligand may include a carbamate group. An associated method is provided.

Composition and associated method

Thermal interface compositions contain both non-electrically conductive micron-sized fillers and electrically conductive nanoparticles blended with a polymer matrix. Such compositions increase the bulk thermal conductivity of the polymer composites as well as decrease thermal interfacial resistances that exist between thermal interface materials and the corresponding mating surfaces. Such compositions are electrically non-conductive. Formulations containing nanoparticles also show less phase separation of micron-sized particles than formulations without nanoparticles.

Thermal conductive material utilizing electrically conductive nanoparticles

A nanostructure having at least one nanotube and at least one chemical moiety non-covalently attached to the at least one nanotube. At least one dendrimer is bonded to the chemical moiety. The chemical moiety may include soluble polymers, soluble oligomers, and combinations thereof. A method of dispersing at least one nanotube is also described. The method includes providing at least one nanotube and at least one chemical moiety to a solvent; debundling the nanotube; and non-covalently attaching a chemical moiety to the nanotube, wherein the non-covalently attached chemical moiety disperses the nanotube. A method of separating at least one semi-conducting carbon nanotube is also described.

Nanotubes and methods of dispersing and separating nanotubes

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Davide Louis Simone