Süss Microtec Photomask Equipment Gmbh & Co. Kg

Suss Microtec Solutions Gmbh & Co. Kg

Davide Dattilo

Uwe Dietze

Martin Samayoa

Habib Hichri

SherJang Singh

Seongkuk Lee

Methods for treating substrates are described. The methods comprise the steps of flowing an aqueous liquid medium through a flow channel and at least one outlet slit onto a substrate to be treated and exposing the aqueous liquid medium to UV-radiation of a specific wavelength at least in a portion of the flow channel immediately adjacent the at least one outlet slit and after the aqueous liquid medium has flown through the outlet opening towards the substrate and thus prior to and while applying the aqueous liquid medium to the surface of the substrate to be treated. In one method, the electrical conductance of the aqueous liquid medium is adjusted to be in the range of 20 to 2000 &#x3bc;S, by the addition of an additive to the aqueous liquid medium, the aqueous liquid medium prior to the addition of the additive having an electrical conductivity below 20 &#x3bc;S, prior to or while exposing the same to the UV-radiation. Additionally, the pH of the aqueous liquid medium may be adjusted to a range of 8 to 11 or 3 to 6 prior to or while exposing the same to the UV-radiation. The adjustments may lead to a shift in an equilibrium of reactive species generated in the aqueous liquid medium by the UV-radiation towards preferred species.

Method for treating substrates with an aqueous liquid medium exposed to UV-radiation

A method and an apparatus for cleaning a substrate having at least one surface having a residue to be removed thereon is described. The method comprises: scanning at least an area of the surface having the residue thereon with laser light to thereby heat the surface and the residue; controlling the heating so that a part of the residue first liquefies such that the liquefied part of the residue starts flowing towards the solid part of the residue, thereby forming a meniscus with the solid part of the residue and accumulating in part on top of the solid part, the thus generated thicker layer of residue absorbing further heat to be decomposed or vaporized.

Method and apparatus for cleaning a substrate and computer program product

An apparatus and a method for cleaning a partial area of a substrate, in particular a photomask, are described. The apparatus has a cleaning head having a lower surface configured to be arranged above and in close proximity to the substrate area to be cleaned, the lower surface having a central opening formed therein, a first annular groove, surrounding the central opening, and at least a second groove, arranged between the first annular groove and the central opening, the first annular groove being fluidly connected to a first port allowing connection to an external supply source and the second annular groove being fluidly connected to a second port allowing connection to an external supply source, a tape supply mechanism arranged to supply an abrasive tape to the central opening in the lower surface of the cleaning head, such that a portion of the abrasive tape protrudes therefrom and a liquid media conduit having an outlet arranged to supply a liquid to a backside of the abrasive tape at or at the vicinity of the central opening. In the method a protruding portion of an abrasive tape, which protrudes from a central opening of a cleaning head is placed in contact with the area of the substrate to be cleaned to thereby bring a lower surface of the cleaning head in close proximity to the substrate area to be cleaned. A liquid is supplied to a backside of the abrasive tape at or at the vicinity of the central opening of the cleaning head, such that at least the portion of the abrasive tape protruding from the central opening is wetted, and a relative movement is caused between the abrasive tape and the surface area of the substrate to be cleaned. The method also encompasses applying a cleaning fluid to the substrate area to be cleaned via at least one first groove or the at least one second groove in the lower surface of the substrate and applying a suction force to the other groove.

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Bretten, Germany

Davide Dattilo