Sabic Innovative Plastics IP B.v.

Sabic Global Technolgoies B.v.

David Zou

Jiru Meng

Dennis Karlik

Mingcheng Guo

Mark Van Der Mee

Ye-Gang Lin

Donghai Sun

Roy l'Abee

Frans Mercx

Yanjun (Frank) Li

Yong Wang

Tong Wu

Xin Huang

Zhaohui Qu

Thomas Arnold Ebeling

Tong Sun

Srinivas Siripurapu

Will Li

Huagui Yang

Qiang Ji

Monica M Marugan

Polymer compositions having improved electromagnetic (EMI) shielding properties under high temperature are disclosed. The polymer compositions comprise a thermoplastic polymer, stainless steel fiber, and optionally one or more of glass fiber, a conductive filler, a second polymer, and other additives. The disclosed compositions maintain heat resistance and other mechanical properties under high temperatures.

Polymer compositions having improved EMI retention

The disclosure relates to blended thermoplastic compositions, and in one aspect to blended thermoplastic compositions comprising a polycarbonate polymer and a high rubber graft acrylonitrile-butadiene-styrene polymer blend, a styrene-acrylonitrile copolymer, and a laser direct structuring additive. These blended thermoplastic compositions are capable of being used in a laser direct structuring process. The present invention also relates to methods of manufacturing these compositions and articles that include these compositions.

Laser direct structuring materials with improved plating performance and acceptable mechanical properties

Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 10Ohm&#xb7;cm. Also disclosed are articles and methods of use therefor.

Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof

Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 10Ohm.cm. Also disclosed are articles and methods of use therefor.

Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof

Flame retardant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic resin, a laser direct structuring additive, and a flame retardant. The compositions offer flame retardant characteristics while also substantially maintaining the mechanical properties of the base thermoplastic resin, such as the impact strength and/or HDT of the composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone and other such communications equipment.

Flame retardant laser direct structuring materials

A flame retardant thermoplastic composition having excellent physical properties that includes 20 to 90 wt. % of a polycarbonate resin; from 1 to 35 wt. % of an impact modifier; from 0.5 to 30 wt. % of a polysiloxane-polycarbonate copolymer including from 8 to 30 wt. % polydimethylsiloxane units or the equivalent molar amount of other diorganosiloxane units; from 0.5 to 20 wt. % of a phosphorus-containing flame retardant, and from 3 to 30 wt. % of metal fiber, each based on the total combined weight of the thermoplastic composition, exclusive of any filler. In one embodiment, a molded sample of the thermoplastic composition having a thickness of 3.0 mm (&#xb1;10%) has an EMI shielding of at least 20 dB. In addition, a molded sample of the thermoplastic composition is capable of achieving UL94 V0 or V1 rating at a thickness of 1.5 mm (&#xb1;10%). The compositions are useful in forming flame retardant articles having EMI shielding characteristics.

Flame retardant thermoplastic compositions having EMI shielding

A thermoplastic composition that includes a base polymer, a fluoropolymer, and a fluoride scavenger having suitable fluoride levels such that use in the electronics industry is appropriate. An extrusion method may be used for making the thermoplastic composition. The compositions may then be used to form a molded article. The composition has lower fluoride levels as compared to thermoplastic compositions without the fluoride scavenger making it suitable for use in electronic applications, as well as medical or food or beverage applications where fluoride ions are a concern.

Low fluoride thermoplastic composition, method of manufacture and product made therefrom

A method of making resin composition having excellent wear properties that includes 50 to 99 wt. % of a polycarbonate resin and from 1 to 50 wt. % of a polyolefin that has been modified with at least one functional group selected from a carboxyl, an acid anhydride, an epoxy groups or mixtures containing at least one of the foregoing functional groups, each based on the total combined weight of the resin composition, exclusive of any filler. The resin composition optionally contains an unmodified polyolefin and/or a bi-functional monomer. The resin composition can be molded into articles having improved wear characteristics. The process is a one-step process that improves the efficiency and/or yield of the resin composition as compared to prior-art two-step processes.

Polycarbonate/polyolefin based resin compositions and their production processes and uses

High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.

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Shanghai, China

David Zou