Oramir Semiconductor Equipment Ltd.

Applied Materials, Inc.

Koninklijke Philips Corporation N.v.

Applied Materials Israel Limited

David Yogev

Yoram Uziel

Amir Wachs

Ehud Poles

Amir Widmann

Nicolaas Johannes Anthonius Van Veen

Amir Livne

Natalie Levinsohn

Rafael Goshen

Yehuda Elisha

Boris Livshitz (Buyaner)

Lev Frisman

Yoram Uzeil

Boris Livshitz Buyaner

Jonathan Baron

Lev Fris Man

Yitzhak Ofer

The present invention generally relates to a radiation detector element wherein a photodiode is transversely fixed to a detector element substrate through at least one connection comprising two fused solder balls, wherein a first of the two fused solder balls contacts the photodiode and a second of the two fused solder balls (contacts the detector element substrate. The invention further relates to a method of transversally attaching two substrates, in particular constructing the above-mentioned radiation detector element. It also relates to an imaging system comprising at least one radiation detector element.

Radiation detector element

Apparatus and a method for removing particles from the surface of a substrate include determining respective position coordinates of the particles on the surface. A beam of electromagnetic energy is directed via an optical cleaning arm at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

In situ module for particle removal from solid-state surfaces

A method and apparatus for removing contaminants from the surface of a substrate. An explosive medium is introduced into a vicinity of the substrate, and a beam of electromagnetic energy is directed toward the substrate. Absorption of the electromagnetic energy causes the explosive medium both to generate a blast wave and to form reactive species, the blast wave and the reactive species cooperating to remove the contaminants from the surface substantially without damage to the surface itself.

Laser-driven cleaning using reactive gases

Apparatus for cleaning a surface of a substrate includes a cooling device, which is adapted to cool a region of the substrate in a vicinity of a particle on the surface, so as to cause a fluid in contact with the surface to form a frozen film in the vicinity of the particle. A radiation source is adapted to direct a beam of energy toward the surface so as to cause vaporization of the film due to absorption of the beam in the film, thereby facilitating removal of the particle from the surface.

Iced film substrate cleaning

Apparatus for semiconductor device fabrication, includes at least one lithography station, which is adapted to project a pattern of radiation from a mask onto a semiconductor wafer. A mask cleaning station is adapted to receive the mask from the at least one lithography station, to clean the mask so as to remove a contaminant therefrom, and so that the cleaned mask may be returned to the at least one lithography station. A robot is adapted to convey the mask between the at least one lithography station and the mask cleaning station. An enclosure contains the at least one lithography station, the mask cleaning station and the robot, so that the mask is conveyed between the at least one lithography station and the mask cleaning station without human contact and without exposure to ambient air.

Advanced mask cleaning and handling

This invention is directed to apparatus and a method for removing particles from a surface, such as a semiconductor wafer. A fluid is applied to the surface on which the particles are distributed so as to coat the particles with the fluid. At least some of these particles have a dimension of less than approximately one micron. A suction force is applied in the vicinity of the surface after applying the fluid so as to remove from the surface the majority of those particles having the dimension of less than approximately one micron.

Condensation-based enhancement of particle removal by suction

Particles are removed from the surface of a substrate. Respective position coordinates of the particles on the surface are determined. A beam of electromagnetic energy is directed at the coordinates of each of the particles in turn, such that absorption of the electromagnetic energy at the surface causes the particles to be dislodged from the surface substantially without damage to the surface itself.

Method and apparatus for local vectorial particle cleaning

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Nesher, Israel

David Yogev