Intel Corporation

David Won-jun Song

Christopher Roy Schroeder

John C Johnson

Paul J Diglio

Nader N Abazarnia

Christopher Wade Ackerman

Arun Krishnamoorthy

Morten S Jensen

Akhilesh P Rallabandi

Joseph F Walczyk

James R Hastings

Sruti Chigullapalli

Todd Michael Young

Lothar Kress

Charles Clifton Fulton

Robert Levi Bennett

Techniques for thermal management of a device under test are discussed. In an example, an apparatus may include a pedestal having a device-specific surface configured to exchange heat with the integrated circuit while the device-specific surface is in contact with a surface of the integrated circuit or separated from the surface of the integrated circuit by a layer of thermally conductive material, and a heat generating element configured to heat the device-specific surface. In certain examples, the pedestal may include a plurality of channels configured to couple to a manifold and to route thermal material from the manifold through an interior of the pedestal for maintaining temperature control of the surface of an integrated circuit under test.

System for thermal management of device under test (DUT)

Thermal interface material handing is described for thermal control of an electronic component under test. In one example, a thermal control unit is adapted to control the temperature of at least a portion of an electronic component during testing. A pedestal between the thermal control unit and the electronic component conducts heat from the electronic component to the thermal head. A conduit extends through a portion of the pedestal, to permit the flow of a liquid thermal interface material from an external source to a space between the pedestal and the electronic component. The liquid thermal interface material improves heat conduction between the electronic component and the pedestal. An elastomeric seal between the electronic device and the pedestal constrains the thermal interface fluid within the space between the electronic component and the pedestal.

Thermal interface material handling for thermal control of an electronic component under test

Growing community of inventors

Chandler, AZ, United States of America

David Won-jun Song