Kla-tencor Technologies Corporation

David Winslow Randall

Lisheng Gao

Ashok V Kulkarni

Kenong Wu

Sharon McCauley

Michal Kowalski

Ariel Tribble

Prashant Aji

Ingrid B Peterson

Ramon Ynzunza

David Bruce Coldren

Kourosh Nafisi

Patrick Huet

Tong Huang

Cecelia Anne Campochiaro

Sandeep Bhagwat

Jianxin Zhang

Vivekanand Kini

Maruti Shanbhag

Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle

Hybrid methods for classifying defects in semiconductor manufacturing are provided. The methods include applying a flexible sequence of rules for defects to inspection data. The sequence of rules includes deterministic rules, statistical rules, hybrid rules, or some combination thereof. The rules included in the sequence may be selected by a user using a graphical interface. The method also includes classifying the defects based on results of applying the sequence of rules to the inspection data.

Flexible hybrid defect classification for semiconductor manufacturing

Techniques for efficiently setting up inspection, metrology, and review systems for operating upon semiconductor wafers are described. Specifically, this involves setting up recipes that allows each system to accurately inspect semiconductor wafers. The invention gathers pertinent information from these tools and presents the information to users in a way that greatly reduces the time required to complete a recipe. One system embodiment includes an inspection system and a review station that is communicatively linked such that the review station can read from and write to an entire set of data stored at the inspection system. The set of data includes image files of features detected by the inspection system.

Inspection system setup techniques

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Redwood City, CA, United States of America

David Winslow Randall