Hewlett-packard Development Company, L.p.

Hewlett-packard Company

Hewlett Packard Enterprise Development LP

David William Mayer

Arlen Lee Roesner

Porter Rodgers Arbogast

Ronald Paul Dean

Tillman Frazier Taylor

Tom J Searby

Sean William Tucker

Kristina Lynn Mann

Jeffrey L Deeney

Bruce Votipka

John P Hoppal

Clint Edward Conrady

Rex Seader

Michael Thornton

Neil Clark

Examples herein disclose a connector guide assembly. The connector guide assembly includes a connector frame and multiple protruding members. The connector frame includes multiple side walls. The multiple protruding members are coupled to the side walls of the connector frame such that the multiple protruding members extend substantially perpendicular to the connector frame and are located on opposing side walls of the connectors frame.

Connector guide assembly with a protruding member

Embodiments include methods, apparatus, and systems for a cable strain relief. One embodiment includes a cable strain relief having a body for supporting cables connected to a computer. A bracket and arm connect to the body so the body can rotate to plural different locked positions.

Rotating cable strain relief

A multiple IC package module comprises a plurality of IC devices inserted in associated sockets mounted on a substrate. Each IC device has opposed, major surfaces, one of the major surfaces of each device confronting the socket into which the device is inserted. A compressible compliance layer is interposed between the one major surface of each IC device and the associated socket into which the IC device is inserted. The module further comprises a single heat sink having a surface in heat transfer relationship with the other of the major surfaces of the IC devices. Also disclosed is an IC device package comprising an IC device including interconnect pins projecting from the device, a socket comprising contact receptacles for receiving the interconnect pins, and a compressible compliance layer interposed between the IC device and the socket, the interconnect pins projecting through the compliance layer and into the contact receptacles in the socket.

Multiple integrated circuit package module

A rack computer system. In one embodiment, a rack structure having a pair of mounting legs each having a rail interface oriented in a plane transverse to the pair of mounting legs. The rack computer system also has a computer chassis having a pair of mounting rails movable along the rail interface between a plurality of mounting depths oriented along the plane. In another embodiment, a method of forming a versatile rack mount. The method comprises providing a rack structure having dual mounting legs, coupling at least part of a rail and rail interface assembly to the dual mounting legs, and enabling variable-depth mounting of a desired computer chassis via the rail and rail interface assembly

Multi-configurable telecommunications rack mounting system and method incorporating same

A system having a power module mount adapted to support a power module side-by-side with a card-based processor, and a connectivity guide adapted to guide the power module along a direct path between electrically connected and disconnected relationships with the card-based processor. A method for mounting a power module to a processor involving engaging the power module with a connectivity guide disposed adjacent the processor, moving the power module toward the processor via the connectivity guide, and mating edge connectors of the power module and the processor.

System and method for guidingly mounting a power module to a processor

An electronic device having a processor assembly. The electronic device comprising a first device connectable to the processor assembly a socket assembly adapted to receive the processor assembly, the socket assembly comprising an actuator operable to secure the processor assembly to the socket assembly; and a movable member adapted to prevent the actuator from being operated with the first device connected to the processor assembly An assembly for coupling a processor to an actuatable socket assembly. The assembly comprises a first member adapted to receive the processor and a second member movable relative to the first member. The second member is adapted to prevent the socket assembly from being actuated when the second member is disposed in a first position.

Electronic device having removable processor assembly and method of operating same

A rack computer system. In one embodiment, a rack structure having a pair of mounting legs each having a rail interface oriented in a plane transverse to the pair of mounting legs. The rack computer system also has a computer chassis having a pair of mounting rails movable along the rail interface between a plurality of mounting depths oriented along the plane. In another embodiment, a method of forming a versatile rack mount. The method comprises providing a rack structure having dual mounting legs, coupling at least part of a rail and rail interface assembly to the dual mounting legs, and enabling variable-depth mounting of a desired computer chassis via the rail and rail interface assembly.

A retention system is provided for a printed circuit assembly. The retention system comprises a structural wall having a wall edge that defines a slot. A printed circuit assembly is disposed proximate the slot, and a retainer plug is slidably disposed in the slot, such that appropriate movement of the retainer plug locks the retainer plug at a desired location along the slot to limit movement of the printed circuit card.

Retention system for retaining assemblies within an electric device chassis

A tool-less rack mounting system includes a grooved bullet attached to a flange on the end of a slide rail assembly. The bullet protrudes through a clearance hole formed on a corner post of a rack. A hand-releasable clip engages the groove, retaining the bullet in the clearance hole and retaining the flange against the post. The clip may be mounted to a bracket, and the bracket may include features for securing equipment in the rack. A hinged cable management arm may be mounted to the post and to the slide rail assembly without using tools. A flange on one end of the arm includes a clearance hole opening into a channel. The channel engages a standoff mounted to one of the rails of the slide rail assembly. A flange on the other end of the arm may be retained against the post by the bullet and the hand-releasable clip.

Tool-less rack mounting system

Imaging device and cover therefor. One embodiment of the imaging device comprises a frame assembly and at least one hinge releasably mounted to the frame assembly. The at least one hinge pivotally couples the frame assembly in one location on the imaging device. The at least one hinge is readily removable from the frame assembly and remountable to couple the frame assembly in another location on the imaging device.

Imaging device and cover therefor

A tool-less latch mechanism for attaching a panel to an enclosure for electronic equipment such as a computer. A lever is mounted to a first enclosure component at a pivot point and is operable to move in a pivot plane. A pawl extends from the lever substantially orthogonal to the pivot plane, and an arcuate slot is fixed on a second enclosure component. When the lever pivots from an open to a closed position, engagement of the pawl with a first surface of the slot causes relative movement between the enclosure components in a first longitudinal direction. When the lever pivots from the closed to the open position, engagement of the pawl with a second surface of the slot causes relative movement between the enclosure components in an opposite longitudinal direction.

Tool-less latch mechanism for an enclosure panel

A mounting adapter a peripheral device. A strip is adapted to fit across the top or bottom of the device transversely. First and second device engagement tabs engage holes on left and right sides of the device, and first and second chassis engagement tabs engage holes on left and right sides of a chassis opening. The chassis engagement tabs and one of the device engagement tabs are disposed on arms that can be moved elastically in the transverse direction to engage and disengage the tabs with their corresponding holes. The adapter can be fashioned from a unitary piece of metal, and adds only the thickness of the strip to the vertical dimension of the peripheral device.

Low profile tool-less mounting adapter

A low-profile circuit board mounting and connecting scheme employs a conductive standoff having a shoulder, a stem and a head. A circuit board to be mounted on the standoff defines a clearance hole opening into a channel. The clearance hole is sufficiently large to clear the head of the standoff, and the channel is sufficiently wide to clear the stem but not the shoulder. A conductive clip has two resilient prongs. The clip is mounted to the circuit board so that the prongs are disposed along either side of a portion of the channel. The prongs are able to move toward and away from each other in a plane that is parallel to the plane of the circuit board. The prongs engage the head to make an electrical connection when the stem is moved to the end of the channel.

Low-profile mounting and connecting scheme for circuit boards

Disclosed is a mounting bracket for a device comprising a resiliently-deformable surface, having a deforming element disposed therein, and a pair of attachment members disposed on opposite sides of and attached to the surface. The attachment members of the mounting bracket are adapted to interface with the device upon deformation of the deforming element.

Growing community of inventors

Fort Collins, CO, United States of America

David William Mayer