Telefonaktiebolaget Lm Ericsson (publ)

Pgs Geophysical As

Acreo Swedish Ict Ab

Corline Systems Ab

Imego Ab

Quantairf Ag

Rise Acreo Ab

David Westberg

Gert Ingvar Andersson

Mats Carlsson

Rolf Larsson

Ali Fard

Nils Einar Hedenstierna

Milena Anguelova

Alexandra Nafari

Sjoerd Haasl

Anders Uhlin

Birgitta Formgren

Jan Rapp

Omid Esmaeilzadeh Najari

Gert Andersson

A coupled resonator filter including a first parallel resonator including a first capacitance connected in parallel with a first inductance. The filter includes a second parallel resonator including a second capacitance connected in parallel with a second inductance and a third parallel resonator including a third capacitance connected in parallel with a third inductance. Magnetic coupling between the first inductance and the second inductance, between the second inductance and the third inductance, and between the first inductance the third inductance occurs in accordance with first, second and third coupling factors, respectively. A frequency response of the coupled resonator filter includes a notch when values of the first coupling factor, the second coupling factor and the third coupling factor satisfy predetermined conditions.

System and method for integrated filtering and amplification

A device for measuring force components formed from a single crystal material, wherein the device comprises at least one cantilever beam inclined to a wafer plane normal and formed in one piece with a mass body, which mass body provides a mass of inertia. The mass body has a first and a second major surface which are substantially parallel with a wafer plane. A mass body cross section presents a portion which is substantially symmetrical along a centrally (in the thickness direction) located plane parallel with the wafer plane. Disclosed is also a method for its production and an accelerometer comprising at least one such device. The device allow for a more compact 3-axis accelerometer.

Device for measuring force components, and method for its production

A modulator is provided in operative engagement with a sensor element having a plurality of electrodes. The modulator has a single-bit quantizer electrically connected to a digital accumulator. The accumulator accumulates output information received from the single-bit quantizer. The accumulator converts the accumulated output information received from the single-bit quantizer to a multi-bit feedback signal and sends the multi-bit feedback signal in a primary feedback loop back to the sensor element. The quantizer sends a single-bit feedback signal in a secondary feedback loop back to a point before the quantizer.

Method for using a sensor system having a single-bit quantizer and a multi-bit feedback loop

The invention refers to a micromechanical switching device including at least two contact elements ( ), which are provided at least partly movable relative each other and via thermal actuation can be closed and opened, whereby the contact elements ( ) at least partly are comprised of at least two materials ( ) with essentially different thermal expansion coefficients. The contact elements ( ) at excitation are arranged to displace essentially in same level and in different directions.

Device for micromechanical switching of signals

The present invention relates to a balun circuit that includes means for transforming a balanced input signal to an unbalanced signal and impedance changing means. The means for transforming the balun input signal to an unbalanced output signal is a &lgr;/2-waveguide ( ). A first side of the &lgr;/2-waveguide ( ) is connected to a second port (P ) of the balun circuit, while a second side of said &lgr;/2-waveguide ( ) is connected to a third port (P ) of the balun circuit. The impedance changing means is a &lgr;/4-waveguide ( ) of which a first side is connected to a second side of the &lgr;/2-waveguide ( ) and a second side is connected to the first port (P ) of the balun circuit.

Balun

A method and an arrangement for connecting a component, such as a chip (,), on a substrate (,) to a conductive surface of a carrier. The conductive surface can be an earth plane (,) and the carrier can be a printed circuit board. The method and arrangement allow the component to thermally conduct and/or electrically conduct onto the conductive surface.

Method and an arrangement for the electrical contact of components

Conjugate, its preparation and use and a substrate prepared with the

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Uppsala, Sweden

David Westberg