Applied Materials, Inc.

View, Inc.

Other

Soladigm, Inc.

David Walter Groechel

Kenneth S Collins

Jeffrey S Marks

Peter R Keswick

Stephen Clark Brown

Dhairya Shrivastava

Anshu A Pradhan

Chan-Lon Yang

Robert T Rozbicki

Michael Robert Rice

Craig A Roderick

John R Trow

Gerald Z Yin

Douglas Buchberger

Gang Grant Peng

Tetsuya Ishikawa

Jay D Pinson, Ii

Masato M Toshima

Jerry Yuen-Kui Wong

Jerry Yuen Wong

Gordon E Jack

Disha Mehtani

Raymond Hoiman Hung

Tuochuan Huang

Jon Mohn

Han Wang

Nicolas J Bright

Joshua Chiu-Wing Tsui

Eric Askarinam

Li Wu

Jenn C Chow

Lawrence Chang-Lai Lei

Yuen-Kui (Jerry) Wong

Dorothea Buechel-Rimmel

Lawrence C Lei

Robert T Lum

Robert J Steger

Chiu Chan

Chidambara A Ramalingam

Robert Douglas Mikkola

Shinnosuke Kawaguchi

Gang Peng

Fred Conrad Redeker

Juan Carlos Rocha-Alvarez

Vijay D Parkhe

Koichi Ito

Jian Li

Paul Brillhart

Lance A Scudder

James P Cruse

Gerald Zheyao Yin

Semyon Sherstinsky

Jian Ding

Terrance Y Lee

Young Jeen Paik

David Alexander Britz

David Benjaminson

Richard W Plavidal

Paul E Fisher

Halbert Chong

Chunshi Cui

Shawyon Jafari

Petru N Nitescu

Scott Osterman

Maya Shendon

Sourabh Mishra

Katherine Woo

Chan Lon Yang

Kirubanandan Naina Shanmugam

Nitin Shah

Brad Taylor

John Z Smith

John R Henri

Naomi Obinata

Regga Tekeste

Tetsuhiko Sambei

Samuel Luong

Katty Guyomard

Palash Joshi

Moin Ahmed Khan

Avishek Ghosh

Subhaschandra Shreepad Salkod

Joseph J Farah

Satyasrayan Kumaraswamy

Marcus Pereira

Joe Waidl

Embodiments described herein relate to chamber component cleaning systems and methods for cleaning a chamber component. The chamber component cleaning system includes a spray station, at least a first cleaning station, a dry station, a component transfer mechanism, and one or more enclosures that enclose the spray station, at least the first cleaning station, the dry station, and the component transfer mechanism. The spray station has a holder to position a chamber component in a path of a flow of a cleaning spray and a movable nozzle to provide the flow of the cleaning spray at a first pressure in a path of portions of the chamber component. The first cleaning station has a push mechanism to force a cleaning fluid through features and/or holes of the chamber component and at least one movable transducer to provide ultrasonic energy to the portions of the chamber component.

Integrated semiconductor part cleaning system

A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

Texturizing a surface without bead blasting

Exemplary semiconductor processing systems may include a chamber body including sidewalls and a base. The chamber body may define an interior volume. The systems may include a substrate support extending through the base of the chamber body. The substrate support may be configured to support a substrate within the interior volume. The systems may include a faceplate positioned within the interior volume of the chamber body. The faceplate may define a plurality of apertures through the faceplate. The systems may include a leveling apparatus seated on the substrate support. The leveling apparatus may include a plurality of piezoelectric pressure sensors.

Semiconductor substrate support leveling apparatus

Onboard EC window controllers are described. The controllers are configured in close proximity to the EC window, for example, within the IGU. The controller may be part of a window assembly, which includes an IGU having one or more EC panes, and thus does not have to be matched with the EC window, and installed, in the field. The window controllers described herein have a number of advantages because they are matched to the IGU containing one or more EC devices and their proximity to the EC panes of the window overcomes a number of problems associated with conventional controller configurations.

Onboard controller for multistate windows

Exemplary semiconductor chamber component cleaning systems may include a receptacle. The receptacle may include a bottom lid that may be an annulus. The annulus may be characterized by an inner annular wall and an outer annular wall. A plurality of recessed annular ledges may be defined between the inner annular wall and the outer annular wall. Each recessed annular ledge of the plurality of recessed annular ledges may be formed at a different radial position along the bottom lid. The cleaning systems may include a top lid removably coupled with the bottom lid about an exterior region of the top lid. The cleaning systems may include a tank defining a volume to receive the receptacle.

Semiconductor chamber component cleaning systems

Embodiments described herein relate a cleaning fixture and method to prevent chemical solutions from contacting the various substrate supporting member features and penetrating into the holes and the metal plate of the substrate supporting surface. The cleaning fixture includes a mounting plate having a plurality of thru-holes arranged on a bolt circle and configured to align with a plurality of thread holes disposed in an electrostatic chuck, a recess formed in the mounting plate, and a gas port formed through the mounting plate. A sealed plenum is formed between the recess of the mounting plate and a lower surface of the electrostatic chuck when the electrostatic chuck is coupled to the mounting plate. The gas port is fluidly coupled to the sealed plenum.

Wet cleaning of electrostatic chuck

This disclosure provides connectors for smart windows. A smart window may incorporate an optically switchable pane. In one aspect, a window unit includes an insulated glass unit including an optically switchable pane. A wire assembly may be attached to the edge of the insulated glass unit and may include wires in electrical communication with electrodes of the optically switchable pane. A floating connector may be attached to a distal end of the wire assembly. The floating connector may include a flange and a nose, with two holes in the flange for affixing the floating connector to a first frame. The nose may include a terminal face that present two exposed contacts of opposite polarity. Pre-wired spacers improve fabrication efficiency and seal integrity of insulated glass units. Electrical connection systems include those embedded in the secondary seal of the insulated glass unit.

Connectors for smart windows

Embodiments of a methods and cleaning systems for cleaning components for use in substrate processing equipment are provided herein. In some embodiments, a cleaning system includes a boiler having a heater configured to heat a fluid; a clean chamber fluidly coupled to the boiler via at least one of a gas line and a liquid line, wherein the clean chamber includes one or more fixtures in an interior volume therein for holding at least one component to be cleaned, and wherein the clean chamber includes a heater for heating the interior volume; and an expansion chamber fluidly coupled to the clean chamber via a release line for evacuating the clean chamber, wherein the release line includes a release valve to selectively open or close a flow path between the expansion chamber and the clean chamber, and wherein the expansion chamber includes a chiller and a vacuum port.

Hyperbaric clean method and apparatus for cleaning semiconductor chamber components

Embodiments described herein relate to a gas line cleaning system and a method of cleaning gas lines. The gas line cleaning system includes a connector having a first end and a second end, and a fluid system. The fluid system includes a fluid source configured to flow a fluid through a fluid conduit connected to the first end, and an ultrasonic transducer coupled to the fluid conduit configured to apply an ultrasonic energy to the fluid conduit to agitate the fluid. The ultrasonic energy creates a mechanical energy that reverberates in the fluid conduit and propagates into the fluid to remove particles that may have formed on an inside surface of a gas line connected to the second end and carry away particles inside the gas line.

Wet cleaning inside of gasline of semiconductor process equipment

One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Method for fabricating chamber parts

A method for detecting corrosion on a conductive object includes submerging a surface of the conductive object at least partially in an aqueous solution, flowing current through the surface of the conductive object by forming a voltage differential across the surface, varying the voltage differential across the surface while monitoring the current through the surface of the conductive object, determining a total charge corresponding to a corrosion level of the surface of the conductive object based on current versus voltage levels. The corrosion level may further be utilized in selecting a cleaning process to remediate the corrosion of the surface based on the corrosion level and in applying a protective corrosion barrier to on at least part of the surface after the cleaning process.

Methods and apparatus for detecting corrosion of conductive objects

The present disclosure generally relates to methods of electro-depositing a crystalline layer of pure aluminum onto the surface of an aluminum alloy article. The methods may include positioning the article and an electrode in an electro-deposition solution. The electro-deposition solution includes one or more of an aluminum halide, an organic chloride salt, an aluminum reducing agent, a solvent such as a nitrile compound, and an alkali metal halide. The solution is blanketed with an inert gas, agitated, and a crystalline layer of aluminum is deposited on the article by applying a bias voltage to the article and the electrode.

Aluminum plating at low temperature with high efficiency

Growing community of inventors

Sunnyvale, CA, United States of America

David Walter Groechel