Intel Corporation

Other

Usg Interiors, Inc.

David W Song

Je-Young Chang

Ashish Gupta

Edvin Cetegen

Paul J Diglio

Martin W Brown

Arnab Choudhury

Te Hua Lau

Huy John Ba Vu

Bangii Cao

Je-Yong Chang

Examples of thermal contact devices and methods are shown. Compliant thermal contact devices are shown that include interleaved conducting structures to provide a high thermal conduction contact area. Selected examples include a thermal interface material located at the interleaved interface between the conducting structures. Selected examples also include designs for alternate chip orientations.

Compliant thermal contact device and method

A heat dissipation lid that includes a plate having a first surface, an opposing second surface, and at least one sidewall extending from the plate second surface. The heat dissipation lid also includes at least one fluid delivery conduit and at least one fluid removal conduit, each extending between the plate first and second surface, and at least one spacing projection extending from the plate second surface to establish and maintain a desired distance between the plate second surface and a microelectronic device, when the heat dissipation lid is positioned to remove heat from the microelectronic device.

Heat dissipation lid having direct liquid contact conduits

An apparatus including a cold plate body; a channel module disposed within the cold plate body including a channel body and a plurality of channels projecting through the channel body; and a manifold disposed on the channel module, the manifold including an inlet and an outlet and a first plurality of apertures in fluid communication with the inlet and a second plurality of apertures are in fluid communication with the outlet. A method including introducing a fluid to an integrated cold plate disposed on an integrated circuit device, the integrated cold plate comprising a cold plate body extending about the device, the fluid being introduced into a manifold in fluid communication with a channel module disposed between the manifold and a base plate, the channel module, and including channels to direct the fluid toward the base plate, and collecting the fluid returned to the manifold.

Thermal management solution for circuit products

The present invention provides a reclosable storage bag for packaging/containing and transporting objects, such as food. The reclosable storage bag may include a flexible inner liner contoured to the shape of a user's hand and have one or more closure members for sealing the ends of the bag. The user may store food in an interior storage area of the bag and may use the flexible inner liner to grab or hold onto the food so that the user will not have to directly touch the food while eating.

Storage bag

Growing community of inventors

Chandler, AZ, United States of America

David W Song