Lsp Technologies, Inc.

The Boeing Company

Sunrise International, Inc.

Battelle Memorial Institute

Sokol, David

Glover, Keith

Dulaney, Jeff

May, Gary

O'loughlin, Mark E.

David W Sokol

Jeff L Dulaney

Steven M Toller

Craig Thompson Walters

Allan H Clauer

Mark E O'Loughlin

Jeffrey L Dulaney

Richard Henry Bossi

Harold M Epstein

Kevin Richard Housen

Keith Glover

Gary May

Nickolas K McCoy

Patrick M Kenney

Kevin R Houson

Jeff Dulaney

David F Lahrmann

Systems, methods and device provided for combining or splitting laser beams, including a plurality of optical fibers for providing laser beams, an image relay lens for each of the plurality of optical fibers, positioning a prism beam combiner or splitter after the image relay lenses for combining or splitting the laser beams. According to another aspect, the a prism beam combiner or splitter may include a flattened tip to transmit a portion of an input laser beam, a position sensitive detector to receive the transmitted portion of the input laser beam to track a beam axis motion and provide feedback alignment error signals based on the beam axis motion, and a driver to receive the feedback alignment error signals and to drive a motor or piezo actuated beam steering minor based on the feedback alignment error signals, wherein a laser bond inspection method implements the described systems and methods.

Systems, methods and apparatuses for launching laser beams into multiple fibers and/or combining beams

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)×frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Method and apparatus for use in laser shock peening

An apparatus may include a diode-pumped solid-state laser oscillator configured to output a pulsed laser beam, a modulator configured to modify an energy and a temporal profile of the pulsed laser beam, and an amplifier configured to amplify an energy of the pulse laser beam. A modified and amplified beam to laser peen a target part may have an energy of about 5 J to about 10 J, an average power (defined as energy (J)&#xd7;frequency (Hz)) of from about 25 W to about 200 W, with a flattop beam uniformity of less than about 0.2. The diode-pumped solid-state oscillator may be configured to output a beam having both a single longitudinal mode and a single transverse mode, and to produce and output beams at a frequency of about 20 Hz.

Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Protection of laser bond inspection optical components

Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.

Temporal pulse shaping for laser shock peening

Methods, systems, and apparatuses are disclosed for laser bond inspection of an angled or compact bonded article.

Laser bond inspection with compact surface motion sensor

Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser bond inspection applications.

Temporal pulse shaping for laser bond inspection

Methods, systems, and apparatuses are disclosed for laser peening hidden surfaces. In one embodiment, a laser processing pen is provided, the laser processing pen comprising: an elongated member, comprising: a laser pulse entry portion; a laser pulse exit portion, wherein the laser pulse exit portion includes at least one optical lens; and at least one tape guide capable of channeling at least a non-adhesive tape overlay in proximity of the laser pulse exit portion.

Apparatus for laser peening hidden surfaces

Exemplary embodiments are disclosed for the use of Lamb waves in laser bond inspection.

Lamb waves for laser bond inspection

Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.

Tape overlay for laser bond inspection

A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.

Laser system and method for non-destructive bond detection and evaluation

A system for neutralizing a buried mine includes a laser that is configured to generate laser energy that communicates through the covering ground material and accesses the mine in a manner sufficient to neutralize the mine. Neutralization can occur by deflagration or detonation. The laser includes a solid-state lasing medium that is run substantially uncooled during the lasing run. Namely, the lasing medium is operated without cooling until the lasing medium reaches a temperature where thermal population in a lower laser level begins to significantly lower inversion density. Following completion of the lasing run, the lasing medium is cooled at a rate limited only by a thermal stress fracture level of the lasing medium. Operation of the laser in this manner permits the laser to deliver high-irradiance, high-repetition rate pulses according to a burst mode operation that successfully accomplishes neutralization in a desired time period. The burst mode also facilitates preferential selection of the mechanism of laser energy-material interaction to promote rapid penetration rates.

Method and system for neutralization of buried mines

Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.

Growing community of inventors

Dublin, OH, United States of America

David W Sokol