Augat Inc.

Corbesero, Steve R.

Goff, Jay T.

Marian, Steve P.

Mendenhall, David W.

Cotter, Neil J.

David W Mendenhall

David C Giroux

Jay T Goff

Mark E Lewis

Steven P Marian

Cheryne Malo

Steve R Corbesero

Neil J Cotter

Steve P Marian

A compressible retention element of a diameter slightly greater than that of a cooperating cavity, having a low ratio of insertion to withdrawal forces. The retention element further provides insertion and withdrawal forces reduced from that found in the prior art. One embodiment of the retention element includes a cylindrical body, manufactured of a pliant material such as plastic or the like, having a wedge-shaped groove disposed axially along its length on one side and a planar region disposed axially along its length on an opposite side.

Interconnection retention device

A fully programmable connector is provided in which selected ones of the connector contacts can be electrically shorted within the same connector housing body. The housing body includes a plurality of identical cells each containing an electrical contact and each configured to contain a shorting clip. One or more shorting clips are retained in intended cells of the housing body to short circuit the corresponding contacts.

Fully programmable connector

A modified high density backplane (MHDB) connector is provided for electrically interconnecting high density printed circuit boards having predetermined interconnect circuitry including high density arrays of ground/signal contact pads, discrete power pads and discrete ground pads. The MHDB connector includes one or more contact modules, a connector housing, a pcb biasing mechanism, connector end caps, a flexible film, two interactive biasing modules for each contact module, and a camming member secured to the pcb to be mated. The interactive biasing modules contact with the flexible film to provide uniform contact force distribution over the interconnect regions of the connector and provide contact rivet displacement tolerance relief. The MHDB connector provides sequenced movement of the pcb to be mated into the contact rivets to provide contact wipe and may provide for alignment of the one pcb with the MHDB connector. The end caps provide for MHDB connector sealing and localized securement of the connector to the pcb. The power contact modules may include supply and return contacts and provide the capability for reconfiguring the MHDB connector for diverse applications. A parallel interconnect embodiment effects electrical engagement between two circuit boards disposed in parallel planes.

High density parallel interconnect

A flex dot wafer probe having utility as an electrical interface between semiconductor wafers and electronic test systems for determining the electrical integrity and performance of integrated circuits. The wafer probe comprises a wafer probe head having a preformed resilient, bendable, formable film mounted on a support member for flexible movement. The wafer probe head is integrated with a probe board which interfaces with an external test system. Wafer contact pads and protrusions are formed on the film in 'mirror-image' patterns corresponding to the contact elements of the integrated circuits and interface contact pads of the probe board, respectively. Coplanar line conductors, formed to control the characteristic impedance of the wafer probe head, provide electrical continuity between the wafer contact pads and the protrusions. The conductive protrusions formed on the wafer contact pads and the film physically and electrically engage the contact elements of the integrated circuits and the probe board, respectively, thereby providing electrical paths for test signals between the external test system and the integrated circuits. The flexible configuration of the wafer probe head ensures that all protrusions are forcibly urged into physical and electrical engagement with the corresponding external contact elements at an acceptable force level which precludes deformation of the protrusions.

Flex dot wafer probe

A high density backplane (HDB) connector is provided for electrically interconnecting high density printed circuit boards. The printed circuit boards have a predetermined geometric conductive pattern which includes high density arrays of individual signal/power contact interconnects and unitary ground strips. The HDB connector comprises a housing module secured to one board and a stiffener module secured to a second board. A compliant contact module mounted within the housing module includes a resilient member, an insulator member having arrays of free-floating rigid contact pins disposed therein, and a flexile film interposed therebetween. The flexile film has a signal/power conductive matrix formed on one side and a continuous ground plane formed on the other side. The compliant contact module further includes prestressed early-mate ground contacts and a plurality of distributed resilient ground contacts. Circuit board mating is effected by pressing the stiffener module down onto the housing module. The prestressed early-mate ground contacts exert forces to bias the second board away from the rigid contact pins. Further downward movement of the stiffener module causes a camming coaction between the stiffener module and the housing module to urge the second board into mating engagement with the rigid contact pins and the distributed resilient ground contacts. Final downward movement of the stiffener effects a wiping action between contact interconnects.

High density backplane connector

Growing community of inventors

Greenville, RI, United States of America

David W Mendenhall