Dow Global Technolgoies LLC

David W Kababik

Jian Jim Wang

Rajen M Patel

Mridula Babli Kapur

Robert Reib

Jason C Brodil

Troy M Tambling

Jian Wang

Shannon E Hunt

Kathleen E Pletcher

Robert N Reib

Mridula Kapur

The present disclosure includes a polyethylene composition that may include a first polyethylene resin having a density of from 0.915 g/cc to 0.970 g/cc and a melt index (I) from 10 g/10 min to 200 g/10 min, when measured according to ASTM D1238 at 190&#xb0; C. and 2.16 kg load, and a second polyethylene resin having a density of from 0.860 g/cc to 0.930 g/cc and a melt index (I) of from 400 g/10 min to 2000 g/10 min. The density of the first polyethylene resin may be greater than the density of the second polyethylene resin and the first polyethylene resin, the second polyethylene resin, or both are copolymers of ethylene monomer and at least one &#x3b1;-olefin comonomer, the &#x3b1;-olefin comonomer including C-C&#x3b1;-olefins. Injection molded articles produced from the polyethylene composition are also disclosed herein.

High processability polyethylene compositions for injection molded articles

A linear low density polyethylene composition suitable for injection molding applications comprising less than or equal to 100 percent by weight of the units derived from ethylene, less than 35 percent by weight of units derived from one or more &#x3b1;-olefin comonomers, and characterized by its density, molecular weight distribution (M/M), a melt index (I), a molecular weight distribution (M/M), vinyl unsaturation, and zero shear viscosity ratio (ZSVR). The linear low density polyethylene composition exhibits low hexane extractable levels.

Polyolefin compositions and uses thereof

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Whitehouse, NJ, United States of America

David W Kababik