Kemet Electronics Corporation

Motorola Corporation

David W Jacobs

Randolph Stephen Hahn

Brandon Summey

Philip Michael Lessner

Chris Stolarski

Antony P Chacko

Yongjian Qiu

Jeffrey Poltorak

Albert Kennedy Harrington

Erik Karlsen Reed

Keith R Brenneman

John Tony Kinard

Gregory Joseph Dunn

Curtis D Moyer

Jaynal Abedin Molla

John D Prymak

Robert T Croswell

Robert H Reuss

Edward A Zarbock

Steven A Voight

Remy J Chelini

Peter A Smith

Keith Lee Moore

Kathleen Anne Tobin

Charles A Rowell

Chris Wayne

Kevin J Nordquist

Alethia Melody

Troy A Trottier

Sheng Jie Xu

Shao Jian Chen

Xiao Juan Ye

Diane A Carrillo

Phillip M Lessner

An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.

Capacitor with volumetrically efficient hermetic packaging

An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.

Solid electrolytic capacitor and method of manufacture

An improved capacitor is described. The capacitor has an anode with an anode lead wire extending from a first face of the anode. A dielectric layer is on the anode and a cathode is on the dielectric. An anode lead with an anode base and a cavernous anode protrusion extending from the base is provided wherein the anode lead wire is in electrical contact with the anode protrusion. A cathode lead with a cathode base is provided wherein the cathode base is in electrical contact with the cathode on a side face wherein the side face is adjacent the first face and the cathode base and said anode base are coplanar.

Solid electrolytic capacitor and method for manufacturing the same

The capacitor has a monolithic anode and at least one anode lead wire extending from the anode. At least one sacrificial lead wire extends from the anode. A dielectric layer is on said anode and a cathode layer is on the dielectric layer. The anode lead wire is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.

Capacitor with sacrificial lead wire configuration and improved manufacturing method thereof

An improved method for forming a capacitor. The method includes the steps of: providing a metal foil; forming a dielectric on the metal foil; applying a non-conductive polymer dam on the dielectric to isolate discrete regions of the dielectric; forming a cathode in at least one discrete region of the discrete regions on the dielectric; and cutting the metal foil at the non-conductive polymer dam to isolate at least one capacitor comprising one cathode, one discrete region of the dielectric and a portion of the metal foil with the discrete region of the dielectric.

Thin solid electrolytic capacitor embeddable in a substrate

A method of marking glass includes providing a glass material with a surface ( ) and using a wire ( ) to mark the surface. The wire is softer than the glass material and does not damage the surface of the glass material.

Method of marking glass

A field emission device (100, 150) includes a cathode plate (102, 180) having electron emitters (116), an anode plate (104, 170) having a phosphor (107, 207, 307, 407) activated by electrons (119) emitted by electron emitters (116), and a vacuum bridge focusing structure (118, 158, 218, 318) for focusing electrons (119) emitted by electron emitters (116). Vacuum bridge focusing structure (118, 158, 218, 318) has landings (121, 122, 221, 322), which are attached to cathode plate (102, 180), and further has bridges (120, 220, 320), which extend above and beyond landings (121, 122, 221, 322, 421) to provide a self-supporting structure that is spaced apart from cathode plate (102, 180).

Field emission device having a vacuum bridge focusing structure and

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Mesa, AZ, United States of America

David W Jacobs