Owens-corning Fiberglas Corporation

Bp Corporation North America Inc.

Cookson Singapore Pte Ltd C/o Alpha Metals, Inc.

David W Garrett

Denny E Black

Alfred Marzocchi

Robert A Schweizer

Ruth A Montag

Thomas A Coakley

George A Corbin

Kenneth F Charter

Albert E Jannarelli

John R Miller

Filled and unfilled polyamide compositions of improved toughness comprise a polyamide component comprising recurring aliphatic terephthalamide units and a modifying component comprising a functionalized block copolymer comprising styrene polymer blocks and rubber blocks comprising ethylene/propylene, ethylene/butylene, or ethylene/pentylene polymer blocks or a combination thereof.

Polyphthalamide composition

Mold compounds for encapsulating semiconductors are disclosed. The compounds achieve high levels of adhesion to uncleaned printed wiring board substrates by minimizing the level of silicone fluid in the compound. Methods for encapsulating semiconductor dies and processes for encapsulating the dies also are disclosed.

Epoxy mold compound and method

Aqueous size compositions for glass fibers including melamine formaldehyde resins, phenoxy resins and epoxy coupling agents which are particularly suitable glass fiber reinforcements for thermoplastics. In particular, chopped glass fibers coated with the size are useful in reinforcing acetal composites.

Glass size compositions, coated glass fibers and reinforced

An aqueous glass size composition comprising a water dispersible phenoxy resin modified with an acid, cyanurate or isocyanurate, and an organosilane coupling agent is disclosed. The glass fibers coated with the aqueous size composition are useful for incorporation into molding compositions for strength improvement.

Glass size compositions and glass fibers coated therewith

A size for glass fibers is disclosed, the size comprising an oxidized polyolefin, a polymeric film former and an organic acid, preferably terephthalic acid or isophthalic acid.

Size for glass fibers

A method for improving the adhesiveness between a polyolefin resin and a sized glass fiber which comprises forming a mixture of the resin, a fiber and an organic acid and molding the mixture.

Resin modification for glass fiber adherence

A liquid binder forming material is added to a preform mold, dispersed chopped glass fiber strand is allowed to free fall into the preform mold to build up a layer of chopped fibers wherein substantially all of the strand is horizontal but otherwise randomly oriented, and the layer of chopped strand is forced down into the resin until completely immersed therein. Preferably, thereafter, the preforms so produced are stacked into tubular magazines with separator sheets between the preforms in each magazine; and the magazines are transported first to a maturation room where the viscosity of the binder forming material is increased to above 20 million centipoise, and then to matched metal dies where the preforms are sequentially fed out of the magazine to between the dies which shape and cure the preforms.

High production method of producing glass fiber resin composites and

Friction compositions of glass fibers bonded with cured organic binders and containing a heat-conducting particulate metal and a binder modifying agent are disclosed. The compositions can optionally contain friction-modifying materials, an elastomer or particulate fillers. The compositions have particular utility as brake or clutch materials and are excellent for automotive application.

Growing community of inventors

Newark, OH, United States of America

David W Garrett