Intel Corporation

David W Frame

Karl H Mauritz

Paul S Levy

Edward Butler

Albert Rudy Nelson

Hany M Fahmy

Christopher J Banyai

Quing-Lun Chen

Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC Cell (RAC). Briefly, in accordance with another embodiment of the invention, a connector has two metal traces that are of different lengths. The parasitic capacitance of the longer metal trace is increased so that the impedance of the two metal traces is substantially equal.

Apparatus and method for coupling to a memory module

A method of self-refresh in a memory array includes initializing a programmable refresh counter of a memory module to an offset value from at least another memory module in the memory array. A data line carrying a system-wide self-refresh indicator signal is interrogated to determine whether any memory module is in a self-refresh mode. The self-refresh mode for the memory module is entered if the programmable refresh counter indicates that a self-refresh cycle is due, and it is determined that no other memory modules are in the self-refresh mode.

Method of self-refresh in large memory arrays

A signal transmission unit includes a first transmission line, a second transmission line, and a tapered transmission line coupling the first transmission line to the second transmission line. The tapered transmission line has a width and a length and the width changes along the length according to one or more functions. The one or more functions include but are not limited to linear functions, non-linear functions, hyperbolic functions, and exponential functions.

Signal transmission unit

A dual-sided circuit board module designed for an operating position that is not perpendicular to a system motherboard will be coupled to the motherboard by leads having at least two different lengths. Because leads of differing lengths have differing associated inductance, the operating characteristics of the leads and therefore the devices coupled to the leads will differ. In order to improve the operating characteristics of the module, integrated circuit packages are selected based on the inductive (and possibly other) qualities of the leads to which the respective packages are coupled. In one embodiment, leads having a larger inductance are coupled to integrated circuit (IC) packages having a smaller inductance and vice versa, which allows the inductive characteristics of the various components of the module to have more closely matching inductive characteristics than would otherwise be possible.

Module having integrated circuit packages coupled to multiple sides with package types selected based on inductance of leads to couple the module to another component

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Phoenix, AZ, United States of America

David W Frame