Cyberoptics Corporation

Cyberoptics Coporation

David W Duquette

Steven K Case

Eric P Rudd

Timothy A Skunes

John P Konicek

Thomas W Bushman

Swaminathan Manickam

Theodore Paul Dale

Paul R Haugen

David Fishbaine

David D Madsen

David M Kranz

John D Gaida

Todd D Liberty

Thomas L Volkman

Scott D Roth

Ferris J Chen

Frederick M Cash, Ii

Brant O Buchika

Robert M Mark

Matthew W Dawson

A wireless substrate-like sensor for teaching transfer coordinates to a robotic substrate handling system is provided. The sensor includes a base portion sized and shaped like a substrate handled by the robotic substrate handling system. An electronics housing is coupled to the base portion. A power module is disposed within the electronics housing and configured to power components of the sensor. At least one edge camera is disposed near an edge of the base portion. The at least one edge camera has a field of view that images an alignment feature of the object within the field of view of the at least one edge camera of the wireless substrate-like sensor. A controller is disposed within the electronics housing and is coupled to the at least one edge camera. The controller is configured to obtain an image from the at least one edge camera and determine a location of the alignment feature and provide the determined location to the robotic substrate handling system.

Wireless substrate-like teaching sensor for semiconductor processing

The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image. The standard difference image is correlated to the registered difference test image (DTR) to generate a registration offset indicative of placement efficacy.

Image analysis for pick and place machines with in situ component placement inspection

A method of measuring and storing a center of rotation of a nozzle in a pick and place machine is provided. The method includes coupling an artifact to the nozzle. A substantially collimated laser beam is directed at the artifact, which is rotated while the collimated laser beam is energized. Edges of a shadow cast by the rotating artifact are detected and used to calculate error of a coordinate of the center of rotation of the nozzle. A coordinate of the center of rotation of the nozzle is calculated based upon a previous coordinate of the center of rotation and the error. The calculated coordinate of the center of rotation is stored for subsequent measurements.

Method for measuring center of rotation of a nozzle of a pick and place machine using a collimated laser beam

A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).

Pick and place machine with improved component pick image processing

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Pick and place machine with component placement inspection

A sensor for sensing placement information of a component to be placed by a pick and place machine is disclosed. The sensor includes a plurality of light sources each of which is disposed to direct illumination at different angles of incidence upon the component. Each source is further adapted to generate light based upon an energization signal. Source control electronics are provided and coupled to the plurality of light sources to successively and/or provide energization signals to each source. A detector is disposed within the sensor relative to the plurality of sources to receive at least one shadow of the component, and provide data at a detector output indicative of the shadow imaged while the component is rotated.

Laser align sensor with sequencing light sources

A method of calibrating a pick and place machine having an on-head linescan sensor is disclosed. The calibration includes obtaining z-axis height information of one or more nozzle tips via focus metric methods, including a Fourier transform method and a normalized correlation method. Additionally, other physical characteristics such as linear detector tilt, horizontal scale factor, and vertical scale factor are measured and compensated for in the process of placing the component. Nozzle runout, another physical characteristic, is also measured by a sinusoidal curve fit method, and the resulting Z-height calibration data is used to later place the component.

Calibration methods for placement machines incorporating on-head linescan sensing

A method and apparatus reduces undesirable glints in an optical position alignment sensor designed to orient components. Collimated light is provided onto the component. A filter is positioned behind the components and is used to block glint generated by the components. The filter is tunable by rotating it about an axis in the plane of the component.

Angle rejection filter

A method and apparatus reduces two types of undesirable glints in an optical position alignment sensor designed to orient at least two components. In one aspect, a method includes using an aperture and a positive optic to block large angle glint generated by the components. In another aspect, a detector is positioned behind the image plane of the components to reduce the effect of small angle glint.

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Minneapolis, MN, United States of America

David W Duquette