Raytheon Company

Hughes Aircraft Company

David T Winslow

Alberto F Viscarra

Kevin C Rolston

Clifton Quan

Scott T Johnson

Ethan Santosh Heinrich

Claudio S Howard

Rosalio S Vidaurri

Melvin S Campbell

James R Chow

Kurt S Ketola

Rohn Sauer

Billy D Ables

John A Crockett, Jr

Michael D Runyan

Larry L Lai

Timothy D Keesey

James P Treinen

Edward L Robertson

Derek Pruden

Kyle W Maxhimer

Colleen Tallman

Veronica P Matterer

Manny Tansavatdi

Kurt J Krause

Hernan E Romero

A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.

Process for fabricating a three dimensional molded feed structure

A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.

Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle

The present invention relates to lightweight antenna arrays and more particularly to an attachment mechanism for attaching a lightweight antenna array to a structure. In one embodiment, an antenna structure includes a platform having a first coefficient of thermal expansion; an antenna panel having a second coefficient of thermal expansion different from the first coefficient, and having first and second opposite ends; and a support structure mounting the panel to the platform. The support structure includes a first spacer element with a first height at the first end of the panel, and a second spacer element with a second height less than the first height between the first and second ends of the panel; a first adhesive layer adhering each spacer element to the platform; and a second adhesive layer adhering each spacer element to the antenna panel. A yield strength of the adhesive layers is less than a yield strength of the spacer elements.

Lightweight antenna attachment structure

Process for fabricating an origami formed antenna radiating structure

A cold plate assembly, which in one embodiment includes a manifold layer comprising one or more input coolant sub-manifold channels and one or more output coolant sub-manifold channels. A metering plate having a plurality of orifices defined there through is disposed adjacent the manifold layer in spaced relation to a cover plate. A core layer is disposed between the metering plate and cover plate, the core layer comprising corrugated fin material. The input sub-manifold channels and output sub-manifold channels are in fluid communication through fluid paths passing through the orifices in the metering plate and the core layer.

Cold plate assembly

A heat exchanger apparatus including a two-dimensional array of heat exchanging conduits, wherein each conduit includes an inlet and an outlet, and a manifold for providing heat exchanging fluid to the inputs of the heat exchanging conduits and for receiving heat exchanging fluid from the outputs of the heat exchanging conduits.

Heat exchanger

A connector providing an offset interconnect has a dielectric body with first and second longitudinally opposed and laterally offset portions and an internal cavity. An offset electrically conductive path is disposed within the internal cavity. The offset electrically conductive path extends from the first portion of the dielectric body to the second portion of the dielectric body. A compressible conductor is disposed within the internal cavity in the second portion of the dielectric body.

Offset connector with compressible conductor

An RF connector includes male and female connector components. The male component has a multi-diameter dielectric housing cylinder with a metal center conductor extending through an opening in the housing. The center pin extends from each end of the dielectric housing. The center pin and the dielectric housing are sized appropriately to provide a matched impedance at microwave frequencies for the use environment to which the male component is connected. The female connector component includes a dielectric body having a center cavity formed therein. A compressible wire bundle forming a compressible conductor member is recessed into the cavity. The compressible conductor protrudes from the far end of the female cavity allowing contact to a mating circuitry. The male connector component is assembled with the female component, the male center pin being brought into electrical contact with the compressible conductor member. The female connector component is not mechanically mounted to the next level of interconnect, but instead the protruding compressible conductor is brought into compressive electrical contact with a mating circuitry on the next interconnect level.

Blind mate non-crimp pin RF connector

A connector which provides an interconnect between a pin and a flat conductor. The connector employs two bundles fabricated of densely packed gold plated wire for the electrical connection to the devices. The bundles are both housed in a dielectric sleeve structure and are themselves connected by a solid conductor. A portion of one wire bundle protrudes from one end of the sleeve structure to make electrical contact with a flat conductor in a mating assembly. The second wire bundle is recessed within the sleeve structure adjacent a second end of the sleeve structure. The pin is inserted into the second end in an installation, making electrical contact with the second wire bundle. The outside body of the connector is threaded, allowing an operator to twist the connector into the mating assembly, not requiring tight tolerances to ensure proper contact. The connector provides a robust electrical connection, and also provides for misalignment of the flat connector in addition to variations in the exact location of the pin. The length of the pin in the mating part can vary considerably, and the connector device still provides a controlled impedance interconnect over microwave frequencies. The connector can be installed in a larger assembly thus providing a large number of interconnections to be mating simultaneously. This is accomplished by providing clearances and tapers in the mating housing.

Threaded double sided compressed wire bundle connector

A large non-hermetic packaging approach that produces a large multichip module or SuperMCM package. The present invention integrates a plurality of multichip module technologies including removable and/or standard high density multilayer interconnect (HDMI) decal substrates, and a reworkable chip on board coating, housed in a mechanically sound, thermally conductive non-hermetic multichip package. A metal substrate has an HDMI substrate and one or more edge printed wiring boards bonded thereto which are interconnected using wire bonds. The HDMI substrate has one or more electronic chips bonded thereto that are connected thereto using wire bonds or other attachment scheme. Components on the one or more edge printed wiring boards are connected to the using edge printed wiring boards wire bonds. The edge printed wiring boards have external attachment pads exposed at their outside edges. A removable cover is disposed over the package except for the external attachment pads at the edges of the package.

Large non-hermetic multichip module package

A fiber optic assembly including an elongated light guiding optical fiber strand, a first conductive layer coated around the elongated light guiding optical fiber strand, an elongated glass capillary surrounding the elongated light conveying optical fiber strand and the conductive coating disposed therearound, and a second conductive layer coated around the elongated glass capillary.

Fiber optic ower distribution

A fiber optic package in which a plurality of fiber optic cables are encapsulated in a layer of flexible material which in turn is bonded to the surface of a low mass, low profile, apertured stiffener member. A portion of the encapsulating material extends beyond the edge of the stiffener and is configured into a plurality of tongues that encapsulate individual ones of the fiber optic cables. The stiffener member is fastened to an apertured backplane. Fittings on the ends of the fiber optic cables extend through the clearance apertures in the stiffener member and the backplane to feed the fiber optic cable to the front face of the backplane for coupling to an associated optical component.

Growing community of inventors

Culver City, CA, United States of America

David T Winslow