Tektronix, Inc.

David T Engquist

Michael J Mende

James H McGrath, Jr

Tony Lee Tarr

Julie A Campbell

Jerry L Wrisley

Steve U Reinhold

Karl A Rinder

Brian S Mantel

Heather J Vermilyea

Richard A Booman

J Steve Lyford

Sam J Strickling

Devin M Bingham

Samuel M Romey

Matthew J Hull

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a test-and-measurement probe within an interior cavity of the shroud, while permitting a second portion of the test-and-measurement probe head to extend out of the shroud into a testing environment. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. A fluid inlet conduit enters the shroud through an access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce a heat-transfer fluid to a probe-head portion of the test-and-measurement probe.

Thermal management system for a test-and-measurement probe

Tip cable component of a measurement probe head assembly

A thermal management system for a test-and-measurement probe that includes a thermally insulated shroud and a fluid inlet conduit. The shroud is configured to enclose a first portion of a probe head of the probe within an interior cavity of the shroud, while permitting a second portion of the probe head to extend out of the shroud. The shroud further includes a fluid outlet passageway configured to permit a heat-transfer fluid to pass from a probe-head end of the interior cavity, through the interior cavity of the shroud, and out of the shroud through an access portion of the shroud. The fluid inlet conduit enters the shroud through the access portion of the shroud, extends through the interior cavity of the shroud, and is configured to introduce the heat-transfer fluid to the probe-head end of the interior cavity.

Measurement probe head assembly

Disclosed is a differential test probe tip. The probe tip comprises a socket of electrically conductive material at a proximate end of the probe tip. The socket includes a concavity to receive a signal pin. The probe tip also comprises a reference body of conductive material surrounding the socket. The probe tip further comprises a insulating spacer element of non-conductive material surrounding the reference body at the proximate end of the probe tip. The insulating spacer element includes a signal port to receive the signal pin into the socket. The insulating spacer element further includes a reference port to receive a reference pin and maintain the reference pin in electrical communication with a proximate end of the reference body.

Shielded probe tip interface

Embodiments of the present invention provide an improved cable assembly for connecting an electrical test and measurement probe to a device under test. One end of the probe is connected to a device under test ('DUT'), while the other end is connected to the instrument through one or more cables. To prevent mechanical stresses to the probe-DUT interface caused by the cables' resistance to bending and twisting, embodiments of the improved cable assembly use one or more pliable spines to hold the cable assembly in position after it has been bent or twisted. This provides a more secure connection to the DUT and prevents damage to the probe-DUT interface. Each spine is anchored to the tip of the probe, and may be further secured by an outer housing or additional anchors. A flexible boot may surround the cable assembly and/or outer housing, further protecting the cables from damage. Alternatively, one or more spines may be placed inside the boot.

Cable assembly with spine for instrument probe

Measurement system with controller and sensor head

A planar body is configured such that its edges engage the sidewall of a via of a device under test to create point electrical contacts and the planar body resists removal of the planar body from the via after insertion. The edges of the planar body may include barbs that create point electrical contacts and resist removal of the planar body from the via after insertion. The end of the body that is inserted into the via may form a tapered tip to facilitate insertion. The end of the planar body that is inserted into the via may include barbs that resist removal of the planar body from the via after insertion. The edges of the planar body may include stops that prevent further insertion of the planar body into the via beyond the stops.

Self-retaining via probe

A shielded signal pass-through or via structure integral with an electronic circuit board is described. The structure includes a rigid inner generally cylindrical conductor; at least a semi-rigid intermediate annular dielectric surrounding the conductor; and a rigid outer annular conductor surrounding the dielectric material. Also described is an interconnect device that presents a contact array in a boss region of a unitary embossed printed circuit board (PCB) optionally equipped with one or more such shielded vias.

Controlled-impedance electronic board vias, method of forming the same, and unitized PCB incorporating the same

A high density logic analyzer probing system has a probe mounting fixture for accurately positioning mounting posts to a device under test (DUT). The mounting posts includes a recess in one side for receiving a spring wire clip that mounts through holes in the DUT. The housing includes protrusions that receive screws for securing the probe head to the mounting posts on the DUT. The screws have a first shoulder that engages the protrusions and a second shoulder that engages the mounting post. The probe head is positioned between the mounting posts and tightened to the DUT using the screws. The first shoulder applies downward pressure on the probe head and the second shoulder provides a positive stop to prevent over tightening of the probe head which can cause damage to probe contacts in the probe head.

High density logic analyzer probing system

Method and apparatus for launching a coaxial cable onto a circuit board is described. In an example, a circuit board includes a front edge and a major surface. The major surface includes a recessed portion open to the front edge, the recessed portion being defined by a stop surface, opposing side surfaces, and a bottom surface. A plurality of conductive pads is disposed on the major surface. A conductive layer is disposed on at least a portion of the bottom surface. The recessed portion is adapted to receive a multiple conductor ribbon cable to provide thereby low-profile communication of the multiple conductor ribbon cable and the circuit board. The multiple conductor ribbon cable having a plurality of first conductors and a plurality of second conductors respectively associated with the plurality of first conductors. The plurality of conductive pads are adapted to receive respective first conductors of the multiple conductor ribbon cable. The conductive layer is adapted to receive respective second conductors of the multiple conductor ribbon cable.

Growing community of inventors

Portland, OR, United States of America

David T Engquist