Kulicke and Soffa Investments, Inc.

Kulicke and Soffa Industries, Inc.

Sv Probe Pte. Ltd.

Avalon Sciences Limited

US Seismic Systems, Inc.

K & S Interconnect, Inc.

Pacific Western Bank

David T Beatson

Christian Hoffman

James E Eder

Eric Lee Goldner

Agop Hygasov Cherbettchian

Gerald Robert Baker

James Kengo Andersen

Deepak Sood

Bahadir Tunaboylu

John Ditri

Edward T Laurent

January Kister

Lawrence B Brown

Edward Lambert Malantonio

E Walter Frasch

Andrew F Hmiel

Norman Lucas

Ashoke Banerjee

Jonn Ditri

Michael Woodward

Horst Clauberg

Krishnan Suresh

Richard M Dow

Habib Kilicaslan

Zhijie Wang

Scott R Williams

Jai R Singh

Michael Hillebrand

Tim W Ellis

Jamin Ling

David F McDevitt

Kenneth K Dury

Paul J Schlosser

David W McKenna

Craig Emmons

A fiber optic transducer is provided. The fiber optic transducer includes a fixed portion configured to be secured to a body of interest, a moveable portion having a range of motion with respect to the fixed portion, a spring positioned between the fixed portion and the moveable portion, and a length of fiber wound between the fixed portion and the moveable portion. The length of fiber spans the spring. The fiber optic transducer also includes a mass engaged with the moveable portion. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.

Fiber optic transducers, fiber optic accelerometers and fiber optic sensing systems

A fiber optic microseismic sensing system is provided. The system includes a plurality of nodes, each of the nodes including a surface portion, an underground portion, and an optical cable extending between the surface portion and the underground portion. The surface portion includes (1) an optical source for transmitting an optical signal along the optical cable to the underground portion, and (2) an optical receiver for receiving a return optical signal propagating along the optical cable from the underground portion. The underground portion includes at least one transducer, each of the at least one transducer including (1) a fixed portion configured to be secured to a body of interest, (2) a moveable portion having a range of motion with respect to the fixed portion, (3) a spring positioned between the fixed portion and the moveable portion, and (4) a mass engaged with the moveable portion. The optical cable includes a length of fiber wound between the fixed portion and the moveable portion of each of the at least one transducer, the length of fiber spanning the spring. In one disclosed aspect of the transducer, the mass envelopes the moveable portion.

Fiber optic microseismic sensing systems

A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum.

Cantilever probe structure for a probe card assembly

A method of processing a probe element includes (a) providing a probe element comprising a first conductive material, and (b) coating only a tip portion of the probe element with a second conductive material.

Probe tip plating

A system for determining wire bonding tool placement for use with a wire bonder and an optical imager is provided. The system includes a prism disposed below the optical imager and the wire bonding tool. The system also includes at least one lens positioned between the prism and a lower portion of the wire bonding tool along a first optical axis. The at least one lens and the prism define an object plane between the at least one lens and the lower portion of the wire bonding tool. The at least one lens is positioned between the prism and the optical imager along a second optical axis. The at least one lens and the prism define an image plane between the at least one lens and the optical imager.

Method and apparatus for mapping a position of a capillary tool tip using a prism

A system for measuring the size of free air balls for use with a wire bonder having a wire bonding tool and an Electric Flame Off (EFO) device is provided. The system includes an imager disposed above a first image plane, a prism disposed below the imager, and at least one lens positioned between the first image plane and the prism in a first optical path. The at least one lens is positioned between the prism and the imager in a second optical path, where the second optical path is different from the first optical path. An image of the free air ball disposed at a lower portion of the wire bonding tool is provided to the imager via the prism and the at least one lens.

Method and apparatus for measuring the size of free air balls on a wire bonder

A method of processing a semiconductor device is provided. The method includes providing a semiconductor device supported by a carrier structure. The carrier structure defines a plurality of vias from a first surface of the carrier structure adjacent the semiconductor device to a second surface of the carrier structure. The method also includes extending a conductor through one of the vias such that a first end of the conductor at least partially extends below the second surface. The method also includes electrically coupling another portion of the conductor to a portion of the semiconductor device.

Integrated ball and via package and formation process

A blade probe card includes a plurality of blades that each includes a first end connected to a printed circuit board and a second end. A probe member is attached to the second end of each blade and extends outward to make contact with a device under test. A ground member is attached to the second end of each blade. The blade probe card also includes a common ground member that is separate from the printed circuit board and coupled to the ground member of each blade. Each blade may also include a first conductive signal trace and two or more conductive ground traces formed on a surface of each blade. The first conductive signal trace electrically connects the probe member to a contact on the printed circuit board. The two or more conductive ground traces are adjacent to the conductive signal trace and reduce crosstalk between the blades.

Blade probe and blade probe card

A wire bonding machine is disclosed for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. At least a portion of the bonding head is pivotable about a first horizontal axis so as to provide vertical displacement of the bonding tool. The bonding head is also rotatably mounted to the bonding machine so as to permit rotation of the bonding tool about a vertically oriented rotational axis. The machine also includes a work table for supporting at least one semiconductor device to be wire bonded. A conveyance system is used to translate the work table in a direction relative to the bonding head and in a substantially orthogonal direction to the horizontal pivot axis of the bonding head.

High speed linear and rotary split-axis wire bonder

A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

Linear split axis wire bonder

Disclosed are interconnect structures and methods which utilize a bonding surface comprising copper nitride. The interconnect structures include a bonding surface comprising copper nitride which is effective at preventing oxidation and/or other unwanted corrosion of the underlying conductive material while providing the basis for a high conductivity bond. The copper nitride bonding surface provides a relatively non-conductive, corrosion-resistant bonding surface while at the same time being readily transformed into a conductive layer at or just prior to the time of bonding.

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

A interconnect assembly features a prefabricated interconnect structure metallurgically bonded to a terminal of a larger structure. Fabrication of the interconnect structure's independently and separate from the larger structure enables the use of economic mass fabrication techniques that are well-known for miniature scale sheet metal parts. During fabrication, positioning and attachment, each interconnect structure is combined with and/or held in a carrier structure from which it is separated after attachment to the terminal. The interconnect structure is configured such that an attachment tool may be brought into close proximity to the attachment interface between the interconnect structure and the terminal for a short and direct transmission of bonding energy onto the attachment interface. The attachment interface provides for an electrically conductive and a bending stress opposing mechanical connection between the interconnect structure and the terminal. The interconnect assembly is preferably part of a probe apparatus.

Prefabricated and attached interconnect structure

A method of processing a semiconductor wafer including a plurality of semiconductor dies is provided. The method includes providing a semiconductor wafer including a plurality of semiconductor dies, at least a portion of the semiconductor dies including contact pads for testing the respective semiconductor die. The method also includes positioning conductive bumps on the contact pads prior to completing wafer testing of the semiconductor wafer and prior to the singulation of the plurality of semiconductor dies from the semiconductor wafer. At least a portion of the conductive bumps are configured to be electrical paths during wafer testing of the semiconductor wafer.

Method of bumping die pads for wafer testing

Growing community of inventors

Kennett Square, PA, United States of America

David T Beatson