Jericho Systems Corporation

Dell USA L P

David Staggs

Vijayababu Subramanium

Michael Dufel

Timothy Schmoyer

James S Bell

Deepak N Swamy

H Scott Estes

Credentials sent over a back channel during the authentication of a user to a RESTful service can elevate the trust the recipient system can place in the user's identity. The addition of an identity credential of higher strength can increase confidence in user identities electronically presented with a lower strength credential. Attributes from either credential can be used to determine authorization to a protected resource.

Elevating trust in user identity during RESTful authentication and authorization

Credentials sent over a back channel during the authentication of a user to a RESTful service can elevate the trust the recipient system can place in the user's identity. The addition of an identity credential of higher strength can increase confidence in user identities electronically presented with a lower strength credential.

Elevating trust in user identity during RESTful authentication

A printed circuit board assembly testing device includes a LISN device connected to a power source and to a test enclosure. The test enclosure includes a power supply and a communication port. A signal analyzer is interfaced to the LISN device. A circuit board assembly unit under test is positioned in the test enclosure. A controlling computer is interfaced to the communication port. The controlling computer includes a hard disk storage device having benchmark data stored therein. A communication bus interconnects the controlling computer to the signal analyzer. The unit under test is powered up and emissions data is observed which correlates to activity in the unit under test. The emissions data is compared to the benchmark data and a determination can be made as to whether the observed data meets the benchmark data within an acceptable tolerance.

Method and apparatus for testing electronic systems using

A circuit board having a thermal relief pattern for isolating heat generated during soldering of components thereon. The circuit board comprises (1) a substantially planar insulating substrate, the substrate having a via therethrough and (2) a substantially planar conductive layer located over the substrate, the via passing through the layer, the layer having a thermal relief pattern comprising a plurality of apertures located about the via, the plurality of apertures cooperating to restrict heat flow across the thermal relief pattern, each of the plurality of apertures having a boundary with the conductive layer free of discontinuities to inhibit edge effect electromagnetic resonance, the plurality of apertures defining a plurality of corresponding conductive bands in the conductive layer and between the plurality of apertures, the conductive bands cooperating to provide a predetermined minimum level of electrical conduction across the thermal relief pattern.

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Austin, TX, United States of America

David Staggs