Hewlett-packard Development Company, L.P.

David Soriano

Justin M Roman

Luke P Sosnowski

Emiliano Gabriel Tolosa Gonzalez

Francesc Roure Pastor

Douglas Pederson

Marti Rius

Santiago Forcada

Samrin Sing

Xavier Gomez Travesset

Pep-Lluis Molinet

Nicola Baldo

Steve Ringwald

Marc Soler

Javier Gonzalez

David Sala Porta

Sergi Ulldemolins

Matthew Baker

Josep-Lluis Molinet

Marina Ferran

In example implementations, a powder level sensor is provided. The powder level sensor includes a capacitive sensor, a processor, and a cleaning mechanism. The processor is communicatively coupled to the capacitive sensor. The processor interprets a measurement of the capacitive sensor to detect a layer of residual build material on a surface of the powder level sensor. The cleaning mechanism may be communicatively coupled to the processor. The processor activates the cleaning mechanism to remove the layer of residual build material on the surface of the powder level sensor.

Cleaning mechanisms for build material level sensors

Techniques for controlling moisture content of build material in a three dimensional printer are provided. An example system includes a build material vessel to contain the build material and receive a flow of air, and a humidifier to adjust the humidity of the air flowing into the build material vessel. The system also includes one or more sensors to determine a dew point of the air flowing into the build material vessel. The humidity level of the air flowing into the hopper is controlled by the humidifier to maintain the dew point at a level that will prevent condensation of water inside the build material vessel.

Controlling moisture content of build material in a three-dimensional (3D) printer

A system for manufacturing three dimensional objects can include logic to detect, for at least one vessel, a moisture content level corresponding to a build material residing in the at least one vessel. The logic can also adjust a humidity level and a temperature of a gas and a conditioning agent applied to the at least one vessel, wherein the humidity level and the temperature are based on the moisture content level and a temperature of the build material residing in the at least one vessel. Additionally, the logic can initialize manufacturing a three dimensional object with the build material from the at least one vessel in response to detecting the moisture content level of the build material residing in the at least one vessel is within a predetermined range.

Three-dimensional (3D) object printing based on a build material, moisture content level

An interlock circuit comprises a plurality of semiconductor switching units electrically connected or connectable in series in a supply line, a plurality of control units electrically connected to the plurality of semiconductor switching units, and a trigger unit electrically connected to the plurality of control circuits. Each control unit activates or deactivates a corresponding semiconductor switching unit in response to trigger signal received from the trigger unit.

Interlock circuit

A power regulation circuit including an input from an alternating current (AC) power supply, a load element connected to the AC power supply input, a dummy power resistor connected in parallel with the load element, and a controller to dynamically control power to the load element and to the dummy power resistor in response to a variation in the power consumption of the load element.

Power regulation circuit and system

There is provided a fastener device and methods of using a fastener device, the device comprising a body having a first end comprising a supporting portion adapted to support at least a rear surface of a connector plug and a second opposite end comprising a latching portion adapted to engage at least a rear surface of a socket when the connector plug is inserted into the socket.

Fastener devices to secure connections

A serial bus system for data communication between devices according to a master-slave protocol has a data bus connecting master and slave devices and a shared clock system arranged to provide a shared-clock signal to the master and slave devices. The master and slave devices are arranged to derive device-individual clock signals which are synchronized with data received on the data bus, from the shared-clock signal and a data-timing indication on the data bus.

Serial bus system

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Terrassa, Spain

David Soriano