Intel Corporation

David Shia

Ralph V Miele

Phil Geng

Jin Yang

Todd P Albertson

Jeffory L Smalley

Sandeep Ahuja

Pooya Tadayon

Mohanraj Prabhugoud

Eric W Buddrius

Jimmy Chuang

Barrett M Faneuf

Abram M Detofsky

Thomas J Wong

Kenan Huseyin Arik

Mengqi Liu

Carlos Alvizo Flores

Brendan T Pavelek

Minh T D Le

Michael T Crocker

Paul J Diglio

Casey R Winkel

Prabhakar Subrahmanyam

Ying-Feng Pang

Kristin L Weldon

Aaron P Anderson

Marc Milobinski

Fernando Gonzalez Lenero

Olaotan Elenitoba-Johnson

Yuyang Xia

Kip P Stevenson

Javier Avalos Garcia

Chia-Pin Chiu

Jun Zhang

Damion T Searls

Mark E Sprenger

Tom E Pearson

Richard J Dischler

Michael L Rutigliano

Xiaoning Ye

Hemant D Desai

George Hsieh

Bijoyraj Sahu

Jessica Gullbrand

Craig J Jahne

Eric Dwight McAfee

Roy Swart

Jin Pan

Neal E Ulen

Shaorong Zhou

Catharina Biber

Timothy Glen Hanna

Eric J M Moret

David M Craig

Warren Stuart Crippen

Michael Berktold

Evan A Chenelly

Yi Xia

Evan M Fledell

Victor Polyanko

Andres Ramirez Macias

Xudong Tang

Lianchang Du

John Michael Peterson

Joseph D Stanford

Keith J Martin

David Rodriguez

Yuehong Fan

Mustapha Amadu Abdulai

Mark Bianco

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Eric D Mcafee

Dinia P Kitendaugh

Charlotte C Kwong

Lothar Kress

Kamil S Salloum

Muhammad Ahmad

Shengzhen Zhang

Yuan Li

Xiaojin Gu

Sean T Sivapalan

Berhanu Wondimu

Xicai Jing

Yuan-Liang Li

Jacob Mcmillian

Maria De La Luz Belmont

Oscar Farias Moguel

Bergen Anderson

John Raatz

Jeffrey Ryan Conner

Samer Melhem

Mohanraj Prabjugoud

Tewodros Wondimu

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

Directly impinging pressure modulated spray cooling and methods of target temperature control

A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.

Circuit devices integrated with boiling enhancement for two-phase immersion cooling

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling mass

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

Technologies for processor loading mechanisms

An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

Magnetically secured semiconductor chip package loading assembly

An apparatus is described. The apparatus includes a ceiling part and a floor part of a thermally conductive component to be placed upon a semiconductor chip package integrated heat spreader to remove heat from at least one semiconductor chip within the semiconductor chip package. Respective inner surfaces of the floor part and the ceiling part are to face one another with space in between such that one or more cavities exist within the thermally conductive component between the respective inner surfaces. The apparatus includes a frame component to be abutted against at least one of the ceiling part and the floor part to impede deformation of at least one of the ceiling part and the floor part when loading forces are applied to a thermal assembly that includes the thermally conductive component and the semiconductor chip package.

Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading force

An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

Boiling enhancement structures for immersion cooled electronic systems

An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.

Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention

An apparatus is described. The electronic circuit board having electronic components thereon. A protective material coated on an exposed material of the electronic circuit board and the electronic components. The protective material being chemically inert with the exposed material. The protective material being chemically inert with an immersion bath cooling liquid that the electronic circuit board and the electronic components are to be immersed within. A thermal cooling structure of one of the electronic components that is designed to transfer heat into the immersion bath cooling liquid is not coated with the protective material.

Selectively applied protective layer on exposed materials of electronic circuit board and electronic components disposed thereon for immersion bath cooled systems

Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.

Technologies for liquid cooling interfaces

Examples described herein relate to a cold plate. In some examples, the cold plate includes a surface with fins and at least two channels, wherein a first channel is shaped with a first opening extending towards the surface, a second opening proximate and across a first fin attached to the surface, and a third opening from the surface and extending away from the surface. In some examples, when a fluid is provided to the first opening, the first opening directs the fluid towards the surface, the second opening directs the fluid across the first fin, and the third opening directs the fluid away from the surface. In some examples, the second opening comprises split openings around opposite sides of the first fin.

Cold plate architecture for liquid cooling of devices

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

Examples described herein relate to a sub-assembly for a fluid cooling system and the sub-assembly can include a fluid inlet, a fluid outlet, and at least one tube that is shaped to conform to surfaces of opposing dual inline memory modules (DIMMs). In some examples, the at least one tube is to connect to the fluid inlet and the fluid outlet. In some examples, the at least one tube includes a heat transferring material. In some examples, the DIMM includes memory devices and regions between memory devices. In some examples, the at least one tube is shaped with recesses to receive memory devices and shaped with protrusions to fit within the regions. In some examples, the at least one tube is formed as a re-shaped tube by shaping of a tube. In some examples, the re-shaped tube is formed by application of pressure within the tube and/or a vacuum external to the tube.

Conformable cold plate for fluid cooling applications

Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

Vacuum modulated two phase cooling loop efficiency and parallelism enhancement

Growing community of inventors

Hillsboro, OR, United States of America

David Shia