Other

National Starch and Chemical Investment Holding Corporation

David Shenfield

Osama M Musa

Bing T Wu

Chaodong Xiao

Ruzhi Zhang

Christine Puglisi

Nikola A Nikolic

Richard Kuder

Hwail Jin

Gregory Krieger

This invention is a film adhesive prepared from an adhesive composition comprising a polymer system, a film forming rubber compound, and curing agents for the polymeric system. The polymer system comprises a base polymer and electron donor and electron acceptor functionality.

Thermoset adhesive films

This invention is an adhesive paste that consists essentially of a polymeric resin in particulate form and a carrier for the resin. The polymeric resin is present as particles with a particles size of 50 microns or smaller, is insoluble in the carrier at ambient temperature, and is soluble in the carrier at a temperature above ambient temperature. The carrier either reacts with the resin to form a covalent bond, or vaporizes from the adhesive paste, at a temperature above the temperature at which the resin is soluble in the carrier. The paste contains no inorganic fillers, holds its geometry on application, and fuses to a void-free bond.

Adhesive paste for semiconductors

Growing community of inventors

Fountain Valley, CA, United States of America

David Shenfield