Hewlett Packard Enterprise Development LP

David Scott Chialastri

Vincent W Michna

Nilashis Dey

Yasir Jamal

Minh H Nguyen

Charles E Cornwell

David A Selvidge

Pinche Tsai

A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.

Variable enhanced processor performance

Example implementations relate to a fluid cooling assembly for a computing system, and a tool-less method of installing the fluid cooling assembly to the computing system. The fluid cooling assembly includes a plurality of cooling components, and a fluid chamber having a plurality of first fluid connectors. Further, each cooling component includes a plurality of second fluid connectors. Each first fluid connector or each second fluid connector includes a first end to protrude beyond a first surface of a circuit board of the computing system, and a second end to protrude beyond a second surface of the circuit board. Further, the first end of each first fluid connector is connected to the first end of a respective second fluid connector via the circuit board, to establish a parallel fluid flow path between the fluid chamber and each of the plurality of cooling components.

Fluid cooling assembly for a computing system

Examples described herein include a backplane keying mechanism. The backplane keying mechanism may include a backplane, a first connector, a second connector, a first block for the first connector, and a second block for the second connector. The first block and the second block may be moveable as one unit on the backplane from a first state to a second state. In the first state, the first block allows the first connect to connect to a first type of device and the second block allows the second connector to connect to the first type of device. In the second state, the first block prohibits the first connector from connecting to the first type of device and the second block prohibits the second connector from connecting to the first type of device.

Backplane keying mechanism

A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Hinged dimm cooling device

An example memory module cooler may include a first liquid manifold, a second liquid manifold, and a cooling tube connected to the first and second liquid manifolds such that. The cooling tube may be connected to the manifolds such that (1) liquid coolant can flow from the first liquid manifold through the cooling tube to the second liquid manifold, and (2) the cooling tube can be rotated relative to the first and second liquid manifolds around a longitudinal axis of the cooling tube. The cooling tube may have an oblong cross-sectional profile.

Growing community of inventors

Houston, TX, United States of America

David Scott Chialastri