Trumpf Werkzeugmaschinen Gmbh + Co. Kg

David Schindhelm

Boris Regaard

Tim Hesse

Winfried Magg

Volker Rominger

Dieter Hallasch

Oliver Bocksrocker

Steffen Kessler

Christian Greger

Boris Reegard

A device for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece. The device includes a focusing unit for focusing a machining beam, in particular a laser beam, onto the workpiece for the formation of a kerf on the workpiece. The device also includes an image acquisition unit to generate at least one image of a region of the workpiece, and an evaluation unit configured to determine, based on the at least one image, at least one measured variable for the course of the gap width of the kerf in a thickness direction of the workpiece. The invention also relates to an associated method for monitoring, in particular for closed-loop control, of a thermal cutting process carried out on a workpiece.

Monitoring a thermal cutting process

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An control apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

Devices and methods for monitoring, in particular for regulating, a cutting process

Described is laser machining nozzles for laser machining devices. The laser machining nozzles includes a body having an inner surface and an outer surface. The inner surface of the laser machining nozzles include at least one subarea. The subarea includes a layer of at least one of the copper oxides CuO and CuO. The layer of CuO and/or CuO has an absorbing effect for radiation at an observation wavelength between 300 and 1100 nm or between 900 and 1700 nm.

Laser machining nozzle for a laser machining device, and laser machining device

An example device for monitoring and controlling a laser cutting process on a workpiece includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Method for monitoring and controlling a laser cutting process

The invention relates to devices and methods for monitoring or regulating a cutting process on a workpiece. A focusing element focuses a high-energy beam onto the workpiece. An image capture apparatus captures a region at the workpiece to be monitored. The region includes an interaction region of the high-energy beam with the workpiece. An evaluation apparatus determines at least one characteristic variable of the cutting process, in particular of a kerf formed during the cutting process, on the basis of the captured interaction region.

This disclosure relates to methods and apparatuses for determining a material type and/or a surface condition of a workpiece. A surface of the workpiece is illuminated with illuminating radiation. At least one image of the illuminated surface is recorded. The material type and/or the surface condition of the workpiece is determined on the basis of a statistical analysis of the at least one image converted into a spatial frequency domain.

Determining a material type and/or a surface condition of a workpiece

The present disclosure relates to a device for monitoring and for controlling a laser cutting process on a workpiece, and a method of using the same. The device includes an image capturing apparatus for capturing an image of a region of the workpiece to be monitored, in which the region of the workpiece to be monitored includes a region of interaction of a laser beam with the workpiece, and an evaluation apparatus for detecting material boundaries of the workpiece using the captured image. The evaluation apparatus is configured to determine at least one characteristic value of the laser cutting process based on a geometric relationship between at least two of the detected material boundaries, the region of interaction, or combinations thereof.

Methods, devices and systems for detecting an incomplete cutting action when cutting a workpiece with a high-energy beam are disclosed. In one aspect, a method includes taking an image of a region of the workpiece to be monitored, the region including an interaction region of the high-energy beam with the workpiece, evaluating the image taken in order to detect pooled slag at an end of the interaction region opposite a cutting front, and detecting whether a related cutting action is incomplete based on an occurrence of detection of pooled slag.

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Stuttgart, Germany

David Schindhelm