Honeywell International Inc.

Other

David Scheid

Ronald James Jensen

Mitch Fletcher

Brian Cornelius

James Alexander Ross

A system may include a package defining a cavity and an integrated circuit (IC) disposed within the cavity. The package may include a first electrically conductive package contact and a second electrically conductive package contact. The IC may include a first electrically conductive IC contact and a second electrically conductive IC contact. The system also may include a wire bond extending between and electrically connecting the first electrically conductive package contact and the first electrically conductive IC contact. The system further may include an electrically conductive adhesive extending between and electrically connecting the second electrically conductive package contact and the second electrically conductive IC contact. Use of wire bonds and electrically conductive adhesive may increase an interconnect density between the IC and the package, while not requiring an increase in size of the IC or a decrease in pitch between wire bonds.

Integrated circuit package including wire bond and electrically conductive adhesive electrical connections

An integrated circuit package includes a thermally and electrically conductive package lid. The package lid may be in electrical communication with an electrically conductive pad connected to a power plane, ground plane, or signal route in the integrated circuit. The electrically conductive package lid may provide an electrical connection for electrical power or electrical signals or may serve as an electrical ground. In some embodiments, the package lid may include a thermally and electrically conductive material. In other embodiments, the package lid may include an electrically insulative substrate coated on at least one surface with a layer of metal or another conductive material. The conductive layer may be electrically connected to electrical ground, a reference voltage, or a signal pay by at least one electrically conductive via.

Integrated circuit package including a thermally and electrically conductive package lid

An integrated circuit package base includes a plurality of tiers. In some examples, an integrated circuit package encloses a plurality of stacked integrated circuits that are each electrically coupled to an electrical contact located on a respective tier of the package base. The tiers of the integrated circuit package can have different elevations relative to a bottom surface of the integrated circuit package.

Multi-tiered integrated circuit package

Processor assemblies and modules are provided. One processor assembly includes first and second processors, and first and second input/output (I/O) interfaces coupled to the first and second processors. The first and/or second I/O interfaces are configured to compare outputs of the first and second processors, and render the first and second processors inactive if the outputs are different. One processor module includes first and second buses coupled to first and second processor assemblies. The first processor assembly includes first and second processors coupled to first and second I/O interfaces, wherein the first I/O interface is coupled to the first bus and the second I/O interface is coupled to the second bus. The second processor assembly includes third and fourth processors coupled to third and fourth I/O interfaces, wherein the third I/O interface is coupled to the first bus and the fourth I/O interface is coupled to the second bus.

Dual-dual lockstep processor assemblies and modules

A method for producing flexible semiconductor assemblies is described. For example, an integrated circuit package consisting of an X-Y axes sensor die and a Z-axis sensor die disposed at 90 degrees to each other may be formed by applying a flexible dielectric membrane to a semiconductor wafer, creating bending gaps between the sensor dice, singulating the IC package from the wafer, and bending the flexible dielectric membrane so that the sensor dice are disposed orthogonally to each other. This method eliminates the need to precisely position previously singulated sensor dice relative to each other in order to apply a flexible dielectric membrane for purposes of interconnecting the dice.

Method of manufacturing flexible semiconductor assemblies

A method of fabricating integrated circuits from a plurality of semiconductor dice, each semiconductor die defining a top side and a bottom side, includes the steps of attaching the bottom sides of the plurality of semiconductor dice to a substrate so that the plurality of semiconductor dice are in adjacent disposition and define one or more bending regions; creating a thin film interconnect on the top sides of the plurality of semiconductor dice and over one or more die gap regions so that the plurality of semiconductor dice are electrically interconnected; removing the substrate from the bottom sides of the plurality of semiconductor dice; and bending the thin film interconnect at the one or more die gap regions so that the bottom sides and the top sides of the semiconductor dice overlap to form a stacked plurality of semiconductor dice.

Growing community of inventors

Eau Claire, WI, United States of America

David Scheid