Agilent Technologies, Inc.

Micron Technology Incorporated

Aptina Imaging Corporation

David S Pitou

Eric James Barton

Jason T Hartlove

Patricia Johnson

Mohammad A Safai

James P Roland

Patricia E Johnson

A camera module includes a gradient index lens on a spacer plate attached over an array of pixel sensors and associated micro lenses. The spacer plate and gradient index lens can be formed at the wafer level during the manufacture of multiple camera modules. A process for manufacturing the camera modules thus provides tolerances and yields provided by wafer processing techniques rather than mechanical assembly.

CMOS image sensor using gradient index chip scale lenses

An imaging device such as a CMOS image sensor has a cover attached to a standoff surrounding a micro-lens array. Standard wafer processing fabricates the standoff (e.g., out of photoresist) and attaches the cover. The standoff maintains a gap over the micro-lenses. An adhesive attaches the cover to the standoff and can be kept away from the micro-lenses by a barrier having a structure similar to the standoff. Particles in the adhesive can prevent the adhesive from squeezing out from between the cover and the standoff during attachment. The standoff (and barrier if present) can provide a vent to prevent pressure in the gap from causing distortion or damage. The shape of the vent can prevent particles from entering the gap. Cutting the attached cover exposes electrical connections and can use preformed grooves in the cover to allow cutting of the cover without damaging underlying circuit elements.

Glass attachment over micro-lens arrays

Socketable flexible circuit based electronic device modules and sockets for electrically and mechanically connecting the electronic device modules to an interconnect substrate are described. The systems provide ways in which the electronic device module may be positioned accurately and securely on an interconnect carrier, while allowing the electronic device modules to be replaced easily without having to resort to laborious desoldering and resoldering operations to remove the modules and connect new modules in their place.

Socketable flexible circuit based electronic device module and a socket for the same

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San Jose, CA, United States of America

David S Pitou