Advanced Micro Devices Corporation

Cypress Semiconductor Corporation

David S Lehtonen

J Courtney Black

Susan Xia Li

Don Carlos Darling

Adam D Fogle

Richard Clark Blish, Ii

Richard C Blish Ii

An electronic device includes a packaged integrated circuit having an integrated circuit die having an active surface, and a molding compound overlaying the active surface of the integrated circuit die. In a particular embodiment, the packaged integrated circuit includes at least approximately five weight percent (5 wt %) zinc relative to the molding compound. In another embodiment, the packaged integrated circuit includes approximately 0.3 &#x3bc;mol/cmof zinc in an area parallel to the active surface of the integrated circuit die.

Electronic device having a molding compound including a composite material

An apparatus for x-raying a semiconductor device which includes semiconductor material and conductive material, the apparatus including a source of x-rays, a filter for receiving x-rays from the source of x-rays and allowing transmission of x-rays to the device, the filter having an atomic number greater than the atomic number of the conductive material of the device, and an x-ray imager for receiving x-rays from the device.

Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection

Growing community of inventors

Austin, TX, United States of America

David S Lehtonen