Rogers Corporation

Raymond Engineering Inc.

Shaw Engineering Associates, LLC

David S Fishman

Michael M Gottlieb

John Ferguson

Robert F Snyder

Jesse R Meisterling

David N Shaw

Henri Buysse

A heat pump system is presented having a primary compressor, a booster compressor, a multi-step thermostat, an indoor coil, an outdoor coil, a refrigerant flow conduit connecting these elements is a closed loop system, and at least one pressure sensor positioned to always sense the refrigerant system low side pressure, which is commensurate with outdoor ambient air temperature in all heating modes of operation. The pressure sensor functions as an override and safety control to prevent or permit operation of the compressors, and also other system components, depending on outside air temperature. The primary compressor is preferably a multi-capacity compressor. A defrost energy transfer fluid is used in a defrost cycle.

Boosted air source heat pump

A torque wrench is presented which has dual output/reaction modes, with the input and output operating in the same direction in both modes. In one mode, a stationary reaction adapter is outside of an inner rotating torque adapter; in the second mode, a stationary reaction adapter is inside of an outer rotation torque adapter. Torque levels are measured by strain gages mounted on a single reaction arm and are read out digitally.

Dual mode torque wrench

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed and consists of a molded housing with integrally molded recesses for a capacitive ceramic chip. The housing also is formed with integrally molded recesses and stabilizing tabs for active pins; and either molded recesses and stabilizing tabs for dummy pins, or molded lugs in lieu of dummy pins. Both the active pins and either the dummy pins or molded lugs are on the same height level to promote symmetry and ease of handling.

Decoupling capacitor and method of manufacture thereof

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic chip, active leads and molded lugs for auto-insertion into printed circuit boards.

A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic chip, active leads and molded lugs for auto-insertion into printed circuit boards. The active leads and molded lugs are on the same height level to promote symmetry and ease of handling.

Growing community of inventors

West Hartford, CT, United States of America

David S Fishman