Linear Technology Corporation

Analog Devices International Unlimited Company

Linear Technology Holding LLC

David Roy Ng

John David Brazzle

Frederick E Beville

Yucheng Ying

Michael J Anderson

Robert C Dobkin

Michael George Negrete

Leonard Shtargot

Steven M Pietkiewicz

Edward William Olsen

Jeffrey Kingan Witt

Xigen Zhou

Zhengyang Liu

Michael G Negrete

A stacked package configuration is described that includes a bottom package and an upper package. The bottom package includes a substrate having a top surface with first circuitry and metal first pads. A molded layer is then formed over the substrate. Holes through the molded layer are then laser drilled to expose the first pads. The holes and first pads align with leads of an upper package, which contains further circuit components. The holes are then partially filled with a solder paste. A thermal epoxy is applied between the molded layer and the upper package. The leads of the upper package are then inserted into the holes, and the solder paste is reflowed to electrically, thermally, and mechanically connect the upper package to the bottom package. The reflow heat also cures the epoxy. A ball grid array is then formed on the bottom of the substrate.

Stacked circuit package with molded base having laser drilled openings for upper package

A cascaded configuration of regulator circuits can be co-integrated within a commonly-shared integrated circuit package (such as an integrated electronic module). Such co-integration can include placing a switched-mode regulator circuit in close proximity to a linear regulator circuit. Magnetic field coupling between the regulator circuits is generally a non-linear function of a separation between the circuits. The switched-mode regulator circuit can generate noise that may adversely impact the linear regulator output. Magnetic coupling between the regulator circuits within the module package can be suppressed or eliminated using a magnetic barrier. The barrier can be magnetically permeable and electrically non-conductive.

Magnetic barrier for power module

An integrated circuit package may include a semiconductor die, a heat spreader, and encapsulation material. The semiconductor die may contain an electronic circuit and exposed electrical connections to the electronic circuit. The heat spreader may be thermally-conductive and may have a first outer surface and a second outer surface substantially parallel to the first outer surface. The first outer surface may be affixed to all portions of a silicon side of the semiconductor die in a thermally-conductive manner. The encapsulation material may be non-electrically conductive and may completely encapsulate the semiconductor die and the heat spreader, except for the second surface of the heat spreader. The second surface of the heat spreader may be solderable and may form part of an exterior surface of the integrated circuit package.

Exposed, solderable heat spreader for integrated circuit packages

System and methodology for controlling output current of switching circuitry having an input circuit and an output circuit electrically isolated from each other. A value of the output current may be determined based on input voltage, input current and reflected output voltage representing the voltage in the input circuit which corresponds to the output voltage. A switching element in the input circuit is controlled to produce the determined value of output current.

Adaptive output current control for switching circuits

A regulator may include a load voltage sensing circuit configured to generate a feedback signal representative of output voltage from an isolated flyback converter. The regulator may include a pulse generator configured to controllably generate the pulses and to increase at least one off time and at least one period of the pulses after a load on the flyback converter decreases.

Light load regulator for isolated flyback converter

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San Jose, CA, United States of America

David Roy Ng