Gennum Corporation

Sound Design Technologies, Ltd.

David Roy

Mark Vandermeulen

Robert E Hawke

William F Hill

Thomas Geoffery Fletcher

Paul Simon Coote

Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Systems and methods for a tilted optical receiver assembly

A hearing instrument includes a faceplate and a shell. The faceplate is a round plate that has a moat defined in the surface of the plate and at least one feature associated with the plate for joining with a hearing instrument component. The moat is a trench or channel that is defined in the surface of the faceplate and includes a wall structure for coupling with a shell of a hearing instrument. The moat may be defined symmetrically about the at least one feature. The moat may be oval in shape and have a rectangular cross-section. A cut out is positioned on the faceplate for use in speeding the excising of material from the faceplate once the shell has been coupled to the faceplate.

Faceplate moat and cut out for hearing instrument

A thick film circuit with a perimeter anchored thick film pad is provided. The thick film circuit includes a base substrate, a thick film bonding pad, and a solder mask layer. The thick film bonding pad is formed on the surface of the base substrate. The solder mask layer is also formed on the surface of the base substrate, and overlaps a portion of the thick film bonding pad in order to improve adhesion between the thick film bonding pad and the base substrate.

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Port Colborne, Canada

David Roy