National Technology & Engineering Solutions of Sandia, LLC

Genia Technologies, Inc.

David Robinson

Patrick J Cappillino

Robert A Yuan

Bill Maney

Markus Wallgren

John L Stickney

Maher Salloum

Christopher G Jones

David M Benson

Leah B Sheridan

A fluid flow control device comprising an insert body having a first portion with a first permeability and second portion with a second permeability that is different from the first permeability. The insert body can be shaped for sealing insertion into a fluid flow structure for fluid flow therethrough. The first portion and the second portion can be arranged in the insert body to cause uniform fluid flow velocity of fluid in the fluid flow structure at an exit of the insert body when the fluid passes through the first portion and the second portion when the insert body is placed inside the fluid flow structure.

Fluid flow control device with different permeabilities

A metal film for use by an additive manufacturing apparatus is described herein. The metal film has a support structure and metal voxels removably attached to the support structure by respective junctions. When a metal voxel in the metal film is impacted by an energy pulse from an energy source of the additive manufacturing apparatus, one or more junctions that attach the metal voxel to the support structure are broken, resulting in the metal voxel detaching from the metal film (at a desired location in a two-dimensional plane).

Metal film for additive metal manufacturing

Additively manufactured monolithic structures for containing and directing flows of fluids are described herein, which can achieve high contact area between fluids and solids while maintaining uniform flow conditions and requiring low applied pressures to yield desired flow rates, for use in heat exchangers, chromatography columns, catalytic converters, etc. An exemplary monolithic structure comprises a plurality of tiled unit cells having a same shape, where the tiled unit cells are integrally formed as a single component. The tiled unit cells are arranged to define one or more interior regions of fluid flow, one or more inlets to each interior region of fluid flow, and one or more outlets to each interior region of fluid flow. The structures and methods of tiling herein are suited to additive manufacturing technologies such as projection stereolithography, multiphoton lithography, etc.

3D-printed apparatus for efficient fluid-solid contact

A process for metallizing a three-dimensional-printed polymeric structure includes soaking the three-dimensional-printed polymeric structure in a metal salt solution; transferring the three-dimensional polymeric structure to a solution comprising a first reducing agent; soaking the three-dimensional polymeric structure in a metal plating bath, the metal plating bath comprising a coordinating agent, a palladium or platinum salt, a pH buffer component, and a second reducing agent, to form a metal plated polymeric structure. A metal plated porous structure and an apparatus for improving metallization are also disclosed.

Electroless deposition of metal on 3D-printed polymeric structures

A method including encapsulating or capping metallic nanoparticles by a dendrimer or a polymer with binding sites for metal particless or metal ions dispersed in a fluid; modifying the fluid to disrupt the interaction of the dendrimer or polymer with the particles; and subsequently or concomitantly sintering or partially consolidating the zero valent metal. A method including introducing a first metal salt and a second metal salt into a dendrimer or a polymer with binding sites for metals or metal ions; reducing a metal ion of the first metal salt to a zero valent first metal and a metal ion of the second metal salt to a zero valend second metal; disrupting an interaction between the dendrimer or the polymer and the first metal and the second metal; and sintering or partially consolidating the first metal and the second metal.

Porous metals from sintering of nanoparticles

A method of electroless atomic layer deposition is described. The method electrolessly generates a layer of sacrificial material on a surface of a first material. The method adds doses of a solution of a second material to the substrate. The method performs a galvanic exchange reaction to oxidize away the layer of the sacrificial material and deposit a layer of the second material on the surface of the first material. The method can be repeated for a plurality of iterations in order to deposit a desired thickness of the second material on the surface of the first material.

Electroless atomic layer deposition

A nanopore based sequencing chip package is disclosed. The nanopore based sequencing chip package includes a reservoir defined by a plurality of surfaces. The chip package includes a nanopore cell array comprising a plurality of nanopore sensor cells enclosed by the reservoir. Each nanopore sensor cell has a working electrode. At least one surface of the reservoir is configured to be in contact with a conducting fluid when the conducting fluid is flowing through the reservoir. The chip package further includes a counter electrode disposed on the at least one surface of the reservoir.

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Hayward, CA, United States of America

David Robinson