General Electric Company

Ge Aviation Systems Limited

Baker Hughes Holdings LLC

David Richard Esler

Emad Andarawis Andarawis

Christopher James Kapusta

David Mulford Shaddock

Wayne Charles Hasz

Mahadevan Balasubramaniam

Arun Virupaksha Gowda

Joseph Alfred Iannotti

Samhita Dasgupta

Zhiyuan Ren

David So Keung Chan

William Lee Herron

Nancy Cecelia Stoffel

James Wilson Rose

Kevin Matthew Durocher

Stephen Daley Arthur

Brian Magann Rush

Richard Alfred Beaupre

Reza Ghandi

Stacey Joy Kennerly

Aaron Jay Knobloch

Cheng-Po Chen

Ertugrul Berkcan

Charles Gerard Woychik

Robert Gideon Wodnicki

Marco Francesco Aimi

Douglas Scott Byrd

Vinayak Tilak

David Martin Mills

Weijun Yin

Rayette Ann Fisher

Brock Matthew Lape

Ansas Matthias Kasten

John Harry Down

Liang Yin

David So Chan

Richard Anthony Eddins

Liqiang Yang

David Walter Parry

David Robert O'Connor

Sandeep Shrikant Tonapi

Judd Everett Swanson

Jie Jiang

Paulo Meneghetti

Sora Kim

Paul Jeffrey Gillespie

Cheryl Lynn Herron, Legal Representative

Scott D Cogan

Ibrahim Issoufou Kouada

Hong Zhong

Laurence Maniccia

Gregory W Shaffer

Paul Joseph Hans

Liangchun Yu

Jeffrey Scott Erlbaum

Gregory A Strosaker

Sambita Dasgupta

Joseph Iannotti

James Edward Grecco

Jennifer David

Hollister Victor

Sara Naomi Paisner

Robert Fortuna

The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.

Electronic connection assembly

An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.

Electrical component with a dielectric passivation stack

A system includes a sensor comprising a sensor bonding layer disposed on a surface of the sensor, wherein the sensor bonding layer is a metallic alloy. An inlay includes a planar outer surface, wherein the inlay may be disposed on a curved surface of a structure. A structure bonding layer may be disposed on the planar outer surface of the inlay, wherein the structure bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer. The inlay comprises at least one of a modulus of elasticity, a shape, a thickness, and a size configured to reduce strain transmitted to the sensor.

Sensor system and method

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Liquid-cooled assembly and method

A power overlay (POL) module includes a semiconductor device having a first side and an opposing second side, a dielectric sheet having a first side coupled to the semiconductor device second side, and an opposing second side, the dielectric sheet defining an aperture therethrough. The POL module also includes a first conductive layer disposed on the second side of the dielectric sheet and electrically coupled through the aperture to the semiconductor device second surface, a first conductive plate having a first side, and an opposing second side coupled to the first surface of the semiconductor device. The POL module further includes a first heat sink coupled the first side of the conductive plate and a first thermal interface layer disposed between the first conductive plate and the first heat sink.

Power overlay module and method of assembling

A semiconductor device is provided. The semiconductor device includes an electric field (E-field) suppression layer formed over a termination region. The E-field suppression layer is patterned with openings over metal contact areas. The E-field suppression layer has a thickness such that an electric field strength above the E-field suppression layer is below a dielectric strength of an adjacent material when the semiconductor device is operating at or below a maximum voltage.

High voltage semiconductor devices having improved electric field suppression

A device comprises: a high temperature semiconductor device comprising a first surface, wherein the high temperature semiconductor device comprises an active area and a termination area disposed adjacent to the active area; an inorganic dielectric insulating layer disposed on the first surface, wherein the inorganic dielectric insulating layer fills a volume extending over an entirety of the termination area and comprises a thickness greater than or equal to 25 &#x3bc;m and less than or equal to 500 &#x3bc;m; and an electrical connector connecting the active area of the high temperature semiconductor device to an additional component of the device.

Power semiconductor devices with high temperature electrical insulation

A sensor assembly includes a die substrate and a metalized layer formed on the die substrate. The metalized layer is formed of a first metal material and includes a bonding pad to facilitate electrically coupling the sensor assembly to a sensor system. A remetalized bump is formed on the bonding pad of a second metal material and is electrically coupled to the metalized layer. An adhesive is applied to the remetalized bump and facilitates mechanically coupling the sensor assembly to the sensor system.

Sensor systems and methods for providing sensor systems

A system includes a structure bonding layer and a sensor. The structure bonding layer is disposed on a structure. The structure bonding layer is a metallic alloy. The sensor includes a non-metallic wafer and a sensor bonding layer disposed on a surface of the non-metallic wafer. The sensor bonding layer is a metallic alloy. The sensor bonding layer is coupled to the structure bonding layer via a metallic joint, and the sensor is configured to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

Methods of fabricating a semiconductor device are provided. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, wherein the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the plurality of semiconductor devices.

Methods of fabricating high voltage semiconductor devices having improved electric field suppression

A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.

A capacitive sensor device and a method of manufacture are provided. The capacitive sensor device includes at least one sensor tip that includes an electrode positioned at a first end of the sensor tip, and a stem member coupled to the electrode and extending toward a second end of the sensor tip. The device also includes a coaxial cable including a center conductor, the center conductor coupled to the sensor tip at the second end, and an insulation layer supporting the sensor tip between the first and second ends. The insulation layer includes a metallization on a portion surrounding the second end of the sensor tip. The device further includes a casing surrounding a portion of the coaxial cable, the metallization, and the coupling of the center conductor and the sensor tip, wherein a braze joint is formed between the casing and the metallization to form a hollow, hermetic cavity.

Capacitive sensor device and method of manufacture

A radial clearance measurement system is provided. The radial clearance measurement system comprises a radial clearance sensor that is relatively insensitive to axial movement of an object rotating relative to the radial clearance sensor. In one embodiment, the radial clearance sensor includes an electrode having a relatively constant overlap area over the range of axial movement of the object.

Rotational clearance measurement system and method of operation

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Gloversville, NY, United States of America

David Richard Esler