Lockheed Martin Corporation

Sige Semiconductor, Inc.

International Business Machines Corporation

M/a -com, Inc.

David R Helms

Phillip Antognetti

Michael Joseph McPartlin

Mark M Doherty

John D Gillis

Dana Jay Sturzebecher

Xiangdong Zhang

John Ditri

Joshua C Park

James M Moniz

Scott Munro

Carl Stuebing

Stuart R Ducker

Jim Griffiths

William G Trueheart, Jr

Brett Ingersoll

Peter W Fox, Jr

Thomas Patrick Higgins

Robert Warrant Point, Jr

James Sweder

Philip Antognetti

A wide bandgap voltage reference circuit generates a temperature stable negative bias reference voltage for use in wide bandgap circuits. The reference circuit uses field effect transistor (FET) based source feedback. It can also be used as source feedback in high power high bandgap device applications, where constant current is required over process and thermal variations.

Apparatus and method for gallium nitride (GaN) amplifiers

A two-stage RF amplifier comprising first and second transistors arranged in cascode. The first transistor cooperatively connected to an input RF signal source through a parallel RC network. The gate of the second transistor terminated with a lossy connection.

High linearity, high efficiency, low noise, gain block using cascode network

A two-stage RF amplifier comprising first and second transistors arranged in cascode. An input stage includes a common source transistor having a gate terminal responsive to an input signal and an output stage includes a common gate transistor having a source terminal operatively connected to the drain terminal of the common source transistor. A shunt feedback network is arranged between a drain terminal of the common gate transistor and the gate terminal of the common source transistor. A source feedback network is arranged between the source terminal of the common source transistor and a reference potential. A common gate feedback network is arranged between the drain terminal of the common gate transistor and a gate terminal of the common gate transistor. And a termination feedback network is arranged in series between the reference potential and the gate terminal of the common gate transistor.

High linearity low noise amplifier

An integrated circuit amplifier comprises: a first planar substrate having an upper surface and a lower surface; a second planar substrate having an upper surface and a lower surface, the lower surface of the second planar substrate physically affixed to the upper surface of the first planar substrate; at least one transistor pair comprising a first and second transistor, formed in the upper surface of the second planar substrate; and a conductor electrically coupling a drain electrode of the first transistor to a source electrode of the second transistor. The first substrate material may have a higher thermal conductivity than the second substrate material. The first material may be Silicon Carbide and may have a thickness of about 10 mils. The second material may be Gallium Arsenide and may have a thickness of about 1 to 2 mils.

Integrated-circuit amplifier with low temperature rise

A radio frequency (RF) power limiter including a signal conductor having an input end and an output end and first and second limiter stages. The first limiter stage comprises a plurality of stacked diode strings arranged in anti-parallel with respect to the signal conductor. The second limiter stage comprises a second plurality of stacked diode strings arranged in anti-parallel with respect to the signal conductor. An all pass filter is arranged between the first and second limiter stages.

Wide bandwidth RF power limiter

An integrated circuit comprises a GaAs substrate thermally and mechanically mounted on a SiC substrate. The GaAs substrate is doped to define first and second transistors. Circuit conductors are defined on the GaAs substrate, which conductors interconnect the source of the first transistor to neutral and the drain to the source of the second transistor. Conductors connect the gate of the second transistor to neutral, to define a cascode amplifier. The SiC substrate supports first and second matching circuits, one of which is connected to the gate of the first transistor, and the other of which is connected to the drain of the second transistor.

A high-power, high frequency (1&#x2013;100 GHz) power amplifier, made using SiGe transistors. A differential common-emitter amplifier section supplies the voltage amplification, allowing the total voltage swing of the amplifier to be twice the breakdown voltage of the individual transistors. Current amplification is supplied by a differential common-emitter amplifier section, connected in cascode with the differential common-emitter amplifier section. Appropriately chosen resonators in the cascode connection resonate out the Miller effect, negative current feed back of the circuit at the amplifier's operational frequency, allowing the amplifier to provide high power output at the operational frequency.

SiGe differential cascode amplifier with miller effect resonator

Prior art architectures of power amplifiers employ a substantial die area, and utilize multiple integrated circuit technologies with a net higher manufacturing cost and large associated packaging area. A new scheme is presented wherein several sense and control signals are used to provide fine and gross control over the key figures of merit associated with integrated semiconductor power amplifiers. How and where these sense and control signals are used is crucial to achieving the most manufacturable and most economic integrated amplifier. In accordance with a first embodiment of the invention, a Dual Feedback-Low power regulation circuit for a three-stage power amplifier integrated circuit is provided. In accordance with a second embodiment of the invention, a current source feedback circuit having low RF output signal power regulation for a three-stage power amplifier integrated circuit is provided. In accordance with a third embodiment of the invention, a detector circuit in the form of an integrated logarithmic current detector circuit in conjunction with a three stage power amplifier integrated circuit. The three embodiments of the invention advantageously overcome the limitations of the prior art.

Integrated power amplifier circuit

A side fed RF amplifier comprising a plurality of transistors connected in parallel such that the base, emitter, and collector leads of each transistor are electrically connected to the base, emitter, and collector leads, respectively, of all other transistors. A common, physical point interconnects the power amplifier current source and the base leads of every transistor. The transistors are arranged such that the impedance between the common physical point and the base lead of any one transistor is substantially equivalent to the impedance between the common point and the base lead of any other transistor within the power amplifier.

Mask layout for sidefed RF power amplifier

A bias network for a radio frequency signal power amplifier. A current source is connected to a source of band gap voltage and produces a current proportional to the voltage. A reference voltage circuit receives the current and produces a voltage which is proportional to the current, as well as changes in temperature. An operational amplifier is used to connect the reference voltage to the power amplifier, so that the power amplifier is effectively isolated from the reference voltage circuit and current bearer circuit. A power amplifier breakdown protection circuit is connected across the output of the operational amplifier for diverting avalanche current produced form the power amplifier away from the power amplifier when the power amplifier output is mismatched through the antenna. Baseband signal transmission from the power amplifier to the bias network circuit is also significantly reduced, thus avoiding the generation of spurious radiation components.

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Tyngsboro, MA, United States of America

David R Helms