Intel Corporation

Intel Corproation

David Pidwerbecki

Mark Angus MacDonald

Mark E Sprenger

Russell S Aoki

Ralph V Miele

David W Browning

Yoshifumi Nishi

Steven Lofland

Shawn McEuen

Bo Qiu

George H Daskalakis

Harish Jagadish

Jerrod Peterson

Michael Ahrens

James Raupp

Stacy L Yee

Paul J Gwin

Prakash Kurma Raju

Prasanna Pichumani

Bijendra Singh

Mark J Gallina

Andrew Larson

Raghavendra Doddi

Gopinath Kandasamy

Johan Ploeg

Babu Triplicane Gopikrishnan

Songnan Yang

Daniel Pohl

Peter A Davison

Koba Natroshvili

Cornelius Buerkle

Jered H Wikander

Shawn S Mceuen

David George Payne

Kenan Huseyin Arik

Roman Schick

Alexander B Uan-Zo-li

Isaac A Simpson

Patrick Chewning

Xi Guo

Brandon Courtney

Kevin J Byrd

Subhas Balappanavar

Mark Hemmeyer

Ponniah Ilavarasan

Michael Stewart

Ellann Cohen

Kwan Ho X Lee

Andreas Herden

Henning Schroeder

Embodiments include apparatuses, methods, and systems for computer assisted or autonomous driving (CA/AD). An apparatus for CA/AD may include a sensor interface, a communication interface, and a driving strategy unit. The sensor interface may receive sensor data indicative of friction between a road surface of a current location of a CA/AD vehicle and one or more surfaces of one or more tires of the CA/AD vehicle. The communication interface may receive, from an external road surface condition data source, data indicative of friction for a surface of a road section ahead of the current location of the CA/AD vehicle. The driving strategy unit may determine, based at least in part on the sensor data and the data received from the external road surface condition data source, a driving strategy for the CA/AD vehicle beyond the current location of the CA/AD vehicle. Other embodiments may also be described and claimed.

Road surface friction based predictive driving for computer assisted or autonomous driving vehicles

There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.

Thermal dissipation in dual-chassis devices

Autonomous unmanned vehicles (UVs) for responding to situations are described. Embodiments include UVs that launch upon detection of a situation, operate in the area of the situation, and collect and send information about the situation. The UVs may launch from a vehicle involved in the situation, a vehicle responding to the situation, or from a fixed station. In other embodiments, the UVs also provide communications relays to the situation and may facilitate access to the situation by responders. The UVs further may act as decoupled sensors for vehicles. In still other embodiments, the collected information may be used to recreate the situation as it happened.

Autonomous unmanned vehicles for responding to situations

Enhanced thermal energy transfer systems for semiconductor packages are provided. A thermally conductive member is disposed in the interstitial space between an upper surface of a semiconductor package and a lower surface of a thermal member. The thermally conductive member is disposed above a first portion of the upper surface of the semiconductor package having a relatively higher thermal energy output when the semiconductor package is operating. A thermal interface material is disposed in the interstitial space and a force applied to the thermal member. The thermally conductive member forms a relatively higher pressure region above the first portion of the semiconductor package and a relatively lower pressure region in other portions of the semiconductor package remote from the thermally conductive member. The increased pressure region proximate the thermally conductive member beneficially enhances the flow of thermal energy from the first portion of the semiconductor package to the thermal member.

Enhanced systems and methods for improved heat transfer from semiconductor packages

Particular embodiments described herein provide for a silicon layer, where the silicon layer includes a profile and a thermal conductor coupled to the silicon layer, where the thermal conductor includes one or more residual stresses. The thermal conductor is modified based on the one or more residual stress such that when pressure is applied to the thermal conductor, a profile of the thermal conductor at least approximately matches the profile of the silicon layer. In an example, the thermal conductor is modified by removing material from one or more areas of the thermal conductor and the thermal conductor is coupled to the silicon layer by one or more pressure inducing mechanisms.

Induced warpage of a thermal conductor

Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices

In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.

Retractable heat exchanger

A method is provided for forming a wireless charging electronic device. An embodiment of the method includes integrating a coil and a collector plate to a chassis of the electronic device to wirelessly charge the electronic device.

Integration of wireless charging coil to a chassis

Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Flexible heat spreader

Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

Super-elastic hinge for flexible display

Growing community of inventors

Hillsboro, OR, United States of America

David Pidwerbecki