Hamilton Sundstrand Corporation

David Perley

Kenneth J Trotman

Kerry R Querns

Charles V DeSantis

Luke T Orsini

Shun-Tien Lin

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

Component vertical mounting

An enclosure includes an enclosure body having an enclosure cavity, the enclosure body formed from a first material, and at least one ballistic tolerant plate disposed within the enclosure cavity to form a plurality of channel enclosures within the enclosure cavity, the at least one ballistic tolerant plate formed from a ballistic tolerant material.

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Manchester, CT, United States of America

David Perley