International Business Machines Corporation

David P Vallet

Jeffrey Alan Kash

Phillip J Nigh

A method of and apparatus ( ) for detecting one or more defects ( ) in a plurality of chips ( ) on a wafer ( ). The method comprises a first step of simultaneously providing electrical power to the plurality of chips, thereby generating one or more light signals ( ) corresponding to the one or more defects in the plurality of chips. The second step is simultaneously forming an image ( ) of the plurality of chips so as to simultaneously detect the one or more light signals. The apparatus ( ) for carrying out the method comprises electrical probes ( ) for providing electrical power to the plurality of chips, a detector ( ) to detect the one or more light signals emitted by the chips as a result of electrical power interacting with the one or more defects, and an imaging system ( ) arranged so as to form an image of the plurality of chips, including the light signals, onto the detection surface ( ).

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Fairfax, VT, United States of America

David P Vallet