General Electric Company

David P Smith

David A Bates

Robert E Belke, Jr

Raymond A Shirk

Ronald B Browne

Richard J Hill

A conductively enclosed hybrid integrated circuit assembly for use with microwave and millimeter wave signals is disclosed. The enclosure utilizes a silicon substrate into which recesses are formed by conventional silicon etching processes to support individual MMIC chips with their surfaces flush with the unetched substrate surfaces. The assembly is covered with a thin solid dielectric layer, perforated over points of connection and followed by a metallization to provide point-to-point connections. The arrangement provides one or more levels of patterned metallizations with additional levels being provided either by additional dielectric layers or by forming the silicon substrate from three or more laminar elements and providing a patterned metallization on the surface of an intermediate element. Efficiency in signal grounding and in rf transmission line paths is assured by surface metallizations and the provision of low impedance paths through the substrate. Fully hermetic seals are provided using conventional silicon processing. Input/Output connections may be either electrical or optical.

Conductively enclosed hybrid integrated circuit assembly using a silicon

The invention deals with a method of electroding a poly(vinylidene fluoride) solid in a piezoelectric application. The electroding method entails surface preparation of the poly(vinylidene fluoride) by a variety of steps including plasma etching to create temporary molecular scale surface irregularities followed by sputtering a metallic layer before deterioration of the plasma etched surface. The chromium may be the initial metal sputtered, followed by a sputtered copper layer, followed in turn by at least one heavier electrodeposited conductive layer. The method may be conducted without deterioration of the piezoelectric properties of the material. The method has been found to provide very good adhesion between the electrode and the PVF.sub.2 surface.

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Clay, NY, United States of America

David P Smith