Speedline Technologies, Inc.

Illinois Tool Works Inc.

Mpm Corporation

David P Prince

Thomas C Prentice

Robert J Balog

A system and method for capturing three-dimensional image data for inspection, alignment and operations of a material applicator includes an imaging system configured to capture three-dimensional image data of an electronic substrate. The imaging system includes one or more illumination assembly configured to project a spectrum of light substantially along a first axis at an angle to the surface of the electronic substrate. The imaging system further includes an image sensor assembly configured to detect the spectrum of light reflected from an electronic substrate surface, with the image sensor assembly including a viewing plane. The material application includes a controller that is coupled to the imaging system. The controller is configured to control movement of the imaging system and to communicate with the image sensor assembly to produce a three-dimensional image of the topology of the electronic substrate.

Color-based linear three dimensional acquisition system and method

A stencil printer apparatus for depositing a solder paste onto the surface of the electronic substrate, comprising a frame, a stencil coupled to the frame, the stencil having a plurality of apertures, a dispenser coupled to the frame, the stencil and the dispenser being configured to deposit the solder paste onto the electronic substrate, an imaging system constructed and arranged to capture an image of the electronic substrate, and a controller coupled to the imaging system and configured to control movement of the imaging system to capture the image. The imaging system comprises a camera element configured to capture the image of at least the portion of the surface of the electronic substrate, and a first illumination element comprising a long-wavelength light source configured to illuminate at least the portion of the surface of the electronic substrate by generating long-wavelength light. Other embodiments and methods are disclosed.

Single and multi-spectral illumination system and method

A stencil printer is provided for depositing solder paste onto a surface of an electronic substrate. The stencil printer includes a frame and a stencil coupled to the frame. The stencil has a plurality of apertures formed therein. The stencil printer further includes a dispenser coupled to the frame. The stencil and the dispenser are adapted to deposit solder paste onto the electronic substrate. The stencil printer further includes an imaging system constructed and arranged to capture an image of the electronic substrate. The imaging system includes a camera assembly, an on-axis illumination assembly adapted to generate light substantially along a first axis generally perpendicular to the surface of the electronic substrate, and an off-axis illumination assembly adapted to generate rays of light substantially along a second axis extending at an angle with respect to the first axis. A controller is coupled to the imaging system to control movement of the imaging system to capture an image.

Off-axis illumination assembly and method

Aspects of the invention are directed to systems and methods for dispensing materials onto a substrate. In one aspect, a dispensing system includes a dispenser having a dispensing outlet positionable over a top surface of the substrate, the dispenser having a substantially vertical dispensing axis along which material from the dispenser is dispensed, and a vision system, coupled to the dispenser, the vision system being positionable to obtain images of the top surface of the substrate along an optical axis, wherein the vision system is constructed and arranged such that the optical axis intersects the dispensing axis.

Imaging and inspection system for a dispenser and method for same

A method of inspecting a stencil having apertures through which a substance is deposited onto an electronic substrate includes depositing the substance through the stencil and onto the substrate, capturing a first image of the stencil after the deposit of the substance and detecting variations in texture of the substance in the first image, capturing a second image of the electronic substrate having the substance on its surface and detecting variations in texture of the substance in the second image, defining a region of interest in the first image and in the second image to determine whether at least one feature exists in the region of interest, measuring a first span of the at least one feature in the region of interest in the first image and a second span of the at least one feature in the region of interest in the second image, and correlating the first span of the at least one feature and the second span of the at least one feature to determine whether a threshold span of the at least one feature has been reached.

Systems for detecting defects in printed solder paste

A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defining a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.

Systems and methods for detecting defects in printed solder paste

The invention relates to a method and apparatus for inspecting a substrate having a substance deposited thereon. The steps of the method include depositing the substance onto the substrate; capturing an image of the substrate; detecting variations in texture in the image to determine a location of the substance on the substrate; and comparing the location of the substance with a desired location. The apparatus includes a screen printer that dispenses a substance at a predetermined location on a substrate, and a machine vision inspection system that includes texture based recognition of the substance.

Method and apparatus for detecting solder paste deposits on substrates

A stencil for applying solder paste in a desired pattern for mounting electronic components on a surface of a circuit board, said stencil including a sheet having holes therethrough in a pattern corresponding to the desired pattern, a smooth upper surface for receiving the solder paste thereon, and a smooth lower surface for contacting the surface of the circuit board, the upper surface having relieved portions so as to increase the friction between the upper surface and the solder paste being squeegeed thereover.

Growing community of inventors

Wakefield, RI, United States of America

David P Prince