International Business Machines Corporation

Lenovo (singapore) Pte. Ltd.

David P Graybill

Madhusudan K Iyengar

Roger R Schmidt

Vinod Kamath

Mark Edward Steinke

Bejoy J Kochuparambil

Timothy Joseph Chainer

Gerard Vincent Weber, Jr

Eric Alan Eckberg

Howard V Mahaney, Jr

Kenneth Robert Schneebeli

Wayne A Barringer

Edward Joseph Seminaro

Alan Frederic Benner

Patrick Anthony Coico

James J Steffes

Michael A Gaynes

Mark Delorman Schultz

Prabjit Singh

Eric James McKeever

Jeffrey A Newcomer

Allan R Hoeft

Richard Rieland

Daniel P Simco

Michael J Ellsworth, Jr

Milnes P David

Pritish Ranjan Parida

Robert K Mullady

Donald W Porter

Amilcar R Arvelo

Steven John Ahladas

Thong N Nguyen

Enrico A Romano

Brian A Canney

Gerard V Weber

Benjamin J Lyndgaard

Eric James Mckeever

An assembly includes: a server rack; first side and second side outer rails attached to the rack and positionally fixed relative to the rack; a support device attached to the rack adjacent to a rear of the rack; a computer network switch having a port side positioned adjacent to the rear of the rack; and first side and second side inner rails attached to the network switch and positionally fixed relative to the network switch, the inner rails being slidably attached to the outer rails. The network switch is movable between a retracted position and an extended position, and the support device is located such that the support device physically blocks the network switch from being removed from the rear of the server rack.

Network switch mounting system

An apparatus includes a connector cover and a lever arm coupled to the connector cover, the lever arm being shaped to accommodate a portion of an activating pin, wherein contact of the activating pin with the lever arm causes a movement of the connector cover from a first position to a second position. The apparatus includes a latch assembly comprising a clamp, the clamp in a clamped position preventing the connector cover from moving from the first position to a second position. The apparatus includes a first bracket with a first indentation, the first indentation being sized to accommodate a portion of a first locating pin, wherein an insertion of the first locating pin into the first indentation moves the clamp from the clamped position to an unclamped position, the unclamped position permitting the connector cover to move when activated by the insertion of the activating pin.

Connector cover with separate activation and latching mechanisms

Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Fabricating cooled electronic system with liquid-cooled cold plate and thermal spreader

Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component

A method is presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.

Apparatus and method for adjusting coolant flow resistance through liquid-cooled electronics rack(s)

Embodiments are directed to decomposing an all-to-all interconnection network topology into a plurality of smaller all-to-all interconnection network elements, replicating the interconnection network elements in a modular fashion, wherein the modular interconnection network elements construct the all-to-all interconnection network topology. Embodiments are directed to an apparatus comprising a shuffle cable assembly comprising a plurality of shuffle cables, where each of the plurality of shuffle cables comprises a plurality of optical fibers and a plurality of connectors, a block configured to organize, align, and maintain a position of the plurality of connectors, and at least one handle coupled to the block and configured to actuate the plurality of connectors.

Modular optical backplane and enclosure

An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.

Multi-rack, door-mounted heat exchanger

Apparatus and method are provided for facilitating air cooling of an electronics rack. The apparatus includes a tile assembly, temperature sensor and controller. The tile assembly is disposed adjacent to the electronics rack, and includes a perforated tile and one or more controllable air-moving devices associated with the perforated tile for moving air through the perforated tile. The temperature sensor is positioned for sensing air temperature adjacent and external to, or within, the electronics rack, and the controller is coupled to the tile assembly and the temperature sensor for controlling operation of the air-moving device. Airflow through the tile assembly is adjusted based on air temperature sensed, thereby facilitating air cooling of the electronics rack. In one embodiment, the tile assembly is a floor tile assembly with an air-to-liquid heat exchanger disposed between the perforated tile and the air-moving device for cooling air passing through the floor tile assembly.

Apparatus and method for facilitating air cooling of an electronics rack

A pluggable module is provided and includes a plug receptacle in which a plug is receivable, a housing coupled to the plug receptacle, a heat removal device partially disposable within the housing to assume and be movable between first and second positions and an armature. The armature is interposed between corresponding portions of the housing and the heat removal device and is configured for selective manipulation to thereby move the heat removal device from the second position to the first position. With the plug received in the plug receptacle and the heat removal device in the first position, the heat removal device forms a thermal pathway with the plug by which heat is removed from the plug.

Pluggable module for heat removal device

An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.

Method for controlling airflow of directional flow perforated tile

Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with multiple coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to control overall heat transfer within the tube sections or across heat exchange assemblies. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.

Apparatus for adjusting coolant flow resistance through liquid-cooled electronics racks

Growing community of inventors

Staatsburg, NY, United States of America

David P Graybill