Apple Inc.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

David P Cappabianca

Shawn Searles

Alexander Kalnitsky

Joseph T DiBene, Ii

Kwan-Yu Lai

Yizhang Yang

Zhitao Cao

Paul McCloskey

Le Wang

Sean Cian O'Mathuna

Zoran Pavlovic

Santosh Kulkarni

William Lawton

Graeme Maxwell

Joseph O'Brien

Hugh Charles Smiddy

An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

Coupled inductor structures utilizing magnetic films

Co-fired integrated circuit devices and methods for fabricating and integrating such on a workpiece are disclosed herein. An exemplary method includes forming a first passive device and a second passive device over a carrier substrate. The first passive device and the second passive device each include at least one material layer that includes a co-fired ceramic material. The carrier substrate is removed after performing a co-firing process to cause chemical changes in the co-fired ceramic material. The first passive device may include a conductive loop disposed between a first magnetic layer and a second magnetic layer. The first magnetic layer, the second magnetic layer, or both includes a co-fired ceramic magnetic material. The second passive device may include a first conductive layer and a second conductive layer separated by a dielectric layer. The first conductive layer, the second conductive layer, or both includes a co-fired ceramic conductive material.

Co-fired passive integrated circuit devices

An embodiment of a system is disclosed, including an inductor, a voltage regulating circuit, a load, and a current detecting circuit. The inductor includes a first wire, a second wire, and a third wire. The third wire is between, and may be inductively coupled to, the first wire and the second wire. The voltage regulating circuit is coupled to a first end of the first wire and a first end of the second wire. The voltage regulating circuit is configured to generate a first current through the first wire and a second current through the second wire. The load is coupled to a second end of the first wire and a second end of the second wire. The current detecting circuit, coupled to ends of the third wire, is configured to generate an output signal based on a third current through the third wire.

Tertiary winding for coupled inductor structures

An inductive device is disclosed, including a first wire coupled to a first terminal and to a second terminal, a non-conductive material surrounding the first wire, and a magnetic film. The non-conductive material spans the region from the first terminal to the second terminal. The magnetic film surrounds at least a portion of the non-conductive material between the first terminal and the second terminal. The first wire has a first amount of inductance.

Integrated magnetic passive devices using magnetic film

A variety of integrated circuit devices and a method for their formation and integration are provided. The integrated circuit devices may include inductors, capacitors, and/or other passive devices. In an exemplary embodiment, a first substrate is received and a conductive material is applied to the first substrate such that a loop of the conductive material is formed on the first substrate. A magnetic material is applied to the first substrate and surrounds at least a portion of the loop. A thermal process is performed on the first substrate having the conductive material and the magnetic material applied thereupon. The conductive material is bonded to a second substrate, and thereafter, the conductive material and the magnetic material are separated from the first substrate.

A shape formed multi-laminate transducer which conforms to nonlinear dependent shaped geometries and the shape forming process for producing the nonlinear dependent shaped multilaminate transducer is presented. The shape forming process includes the cutting of the tape cast material to a predetermined two-dimensional shape and then pressing the cut material to form the desired three-dimensional nonlinear dependent shape. After shape forming, the sample is sintered, metalized, poled, and made into an acoustical device such as a transducer. The production of such a device by using tape cast material allows designers to easily vary the shape of the product as well as to be able to vary the properties within simply by exploiting the lamination method associated with tape casting. As such, a designer is able to design and manufacture a transducer optimized to meet the requirements of a particular application.

Shaped multilayer ceramic transducers and method for making the same

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Gilroy, CA, United States of America

David P Cappabianca