Adeia Semiconductor Bonding Technologies Inc.

Teledyne Flir Commercial Systems, Inc.

Flir Systems, Incorporated

Flir Systems Trading Belgium Bvba

Tessera Technologies Ireland Limited

Digitaloptics Corporation East

Digital Optics Corporation

Nan Chang O-film Optoelectronics Technology Ltd

Tessera Technologies Hungary Kft.

David Ovrutsky

Vage Oganesian

Belgacem Haba

Andrey Grinman

Charles Rosenstein

Laura Wills Mirkarimi

Ilyas Mohammed

Jeremy Huddleston

Guilian Gao

Alan D Kathman

Giles Humpston

Paul C Elliott

David Keller

Hagit Gershtenman-Avsian

Michael R Feldman

William Hudson Welch

James E Morris

Gregory J Kintz

W Hudson Welch

Mark Hiatt

Alexander Feldman

Felix Hazanovich

Yulia Aksenton

Avi Dayan

Ilya Hecht

Roman Gutierrez

Robert J Calvet

Kenneth Allen Honer

Michael James Nystrom

Richard Donovan Jones

Michael D Walters

Osher Avsian

William J Hall

Jennifer L Plyler

Robert Burtzlaff

Mitchell Hayes Reifel

Thomas Mercier

Gregory Fitzgerald

Andrew Aranda

Various techniques are disclosed to provide for reducing undesired reflections in captured images. In one example, a system includes an optical element configured to pass radiation from a scene. The system also includes an imager configured to capture images in response to the scene radiation and reflect at least a portion of the scene radiation to the optical element. The optical element comprises a surface with a convex radius of curvature facing the imager and configured to receive and return the reflected radiation toward the imager in a distribution pattern to reduce a magnitude of the reflected radiation in the captured images. Additional methods, devices, and systems are also provided.

Optical components for ghost image suppression systems and methods

Imager optical systems and methods are provided. In one example, an imaging device includes a window configured to transmit electromagnetic radiation associated with a scene. The imaging device further includes a lens system. The lens system includes a first lens element configured to receive the electromagnetic radiation from the window and transmit the electromagnetic radiation. An aperture stop is positioned between the window and a surface of the first lens element adjacent to the window. The lens system further includes a second lens element adjacent to the first lens element and configured to receive the electromagnetic radiation and direct the electromagnetic radiation to the detector array. The imaging device further includes a detector array including detectors. Each detector is configured to receive the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

Imager optical systems and methods

Techniques for facilitating wide field of view (FOV) imaging systems and methods are provided. In one example, an imaging device includes a lens system including a first lens group and a second lens group. The first lens group includes at least one spherical lens element and is associated with a first FOV. The first lens group is configured to transmit electromagnetic radiation associated with a scene. The second lens group includes wafer level optics aspherical lens elements and is associated with a second FOV narrower than the first FOV. The second lens group is configured to transmit the electromagnetic radiation received from the first lens group. The imaging device further includes a detector array including detectors. Each detector is configured to receive a portion of the electromagnetic radiation from the lens system and generate a thermal image based on the electromagnetic radiation. Related methods and systems are also provided.

Wide field of view imaging systems and methods

Aspect ratio modifying imaging systems and methods are provided. In one example, an infrared imaging device includes at least one lens element configured to transmit electromagnetic radiation associated with a portion of a scene. The portion has a first aspect ratio. The electromagnetic radiation includes mid-wave and/or long-wave infrared light. The at least one lens element has a freeform surface having no translational symmetry and no rotational symmetry. The infrared imaging device further includes a detector array configured to receive image data associated with the electromagnetic radiation from the at least one lens element and generate, based on the image data, an image. The image data has a second aspect ratio different from the first aspect ratio. Each of the first and second aspect ratios is a ratio of a size along a first direction and a size along a second direction orthogonal to the first direction.

Aspect ratio modifying imaging systems and methods

An optoelectronic device package includes an optoelectronic device having an active region on a first surface of a substrate, a bond pad area on the first surface that includes at least one contact pad electrically connected to the active region, and a cap having a first cap surface and a second cap surface, the first cap surface being secured to the first surface of the substrate, the cap covering the optoelectronic device. At least one of the cap and the substrate has an angled sidewall extending at an angle relative to an axis parallel to an optical path. The at least one contact pad is exposed by and adjacent to the angled sidewall. An electrical line extends from each of the at least one contact pad along the angled sidewall and to the second cap surface that does not overlap the active region.

Methods for routing electrical interconnections and resultant structures

A method of singulating includes scribing a first scribe line on a first side of a substrate, scribing a second scribe line on a second side of the substrate, the first and second sides facing away from each other, the second scribe line being substantially parallel to the first scribe line, and simultaneously separating the substrate at the first scribe line and the second scribe line.

Methods for singulation and packaging

A method of manufacturing lenses includes creating a wafer-level master, overmolding the wafer-level master to form a daughter replica, casting a polymer lens shapes onto a wafer using the daughter replica, transferring the polymer lens shapes into the wafer, and singulating the wafer to create individual dies with a lens thereon. The wafer may be silicon, e.g., silicon having a resistivity between 0.1 and 100 &#x3a9;cm.

TIR imaging lens, image capturing system having the same, and associated methods

In one aspect, the present invention provides a wafer level optical assembly comprising a first wafer level optical element, the first wafer level optical element comprising a first alignment structure and a second wafer level optical element, the second wafer level optical element comprising a second alignment structure, wherein the first alignment structure contacts the second alignment structure.

Wafer level optical elements and applications thereof

A microelectronic assembly includes first and second stacked microelectronic elements, each having spaced apart traces extending along a front face and beyond at least a first edge thereof. An insulating region can contact the edges of each microelectronic element and at least portions of the traces of each microelectronic element extending beyond the respective first edges. The insulating region can define first and second side surfaces adjacent the first and second edges of the microelectronic elements. A plurality of spaced apart openings can extend along a side surface of the microelectronic assembly. Electrical conductors connected with respective traces can have portions disposed in respective openings and extending along the respective openings. The electrical conductors may extend to pads or solder balls overlying a face of one of the microelectronic elements.

Off-chip vias in stacked chips

A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.

Packaged semiconductor chips with array

A wafer level lens includes a first lens structure of a first polymeric material coupled to a second lens structure of a second polymeric material, wherein an interface is formed by opposing surfaces of the first lens structure and the second lens structure, the opposing surfaces having no air gap therebetween, at least one aperture disposed between the first lens structure and the second lens structure, wherein the aperture contacts the first lens structure and the second lens structure and wherein a supporting substrate is not positioned between the first lens structure and the second lens structure, and a spacer coupled to and separate from the wafer level lens.

Optical imaging apparatuses are provided having desired focal properties. An optical imaging apparatus can include at least one wafer level optical element, a spacer, a second wafer comprising a focus compensation standoff, and an electro-optical element. For some apparatuses, the focus compensation standoff may include an electro-optical element mounting surface having a roughness different from at least one other surface of the focus compensation standoff. Also described are methods of producing a plurality of optical imaging apparatuses. Some methods include providing an optical wafer having a first and second optical element, determining a first and second focal point of a first and second optical die; providing a second wafer having a first and second focus compensation standoff; and adjusting the heights of the first and second focus compensation standoffs to position a first and second electro-optical element at or near a first and second focal point, respectively.

Focus compensation for optical elements and applications thereof

A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements each having a front surface, contacts exposed at the front surface, a rear surface and edges extending between the front and rear surfaces. Traces connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face of the microelectronic unit. A plurality of conductors may extend along edges of the microelectronic elements from the traces to the top face. The conductors may be conductively connected with unit contacts such that the unit contacts overlie the rear surface of the at least one microelectronic element adjacent to the top face.

Reconstituted wafer stack packaging with after-applied pad extensions

Growing community of inventors

Charlotte, NC, United States of America

David Ovrutsky