International Business Machines Corporation

Adeia Semiconductor Bonding Technologies Inc.

Idex Biometrics Asa

Idex Asa

Neoconix, Inc

Idex Biometrtics Asa

David Noel Light

Perminder S Bindra

John W Smith

Thomas H DiStefano

Masud Beroz

John Steven Kresge

Belgacem Haba

Fred George Benkley

Hung-Ming Wang

Allan P David

David Rodney Baker

Joseph Charles Fjelstad

Konstantine N Karavakis

Lisa Jeanine Jimarez

Charles Robert Davis

Ajit Kumar Trivedi

Thomas P Duffy

Howard L Heck

Matthew T Hendrickson

Steven L Hanakovic

John T Kolias

Voya Rista Markovich

Paul Alfred Lauro

George Frederick Walker

David Brian Stone

Jerome J Cuomo

Sung Kwon Kang

Douglas Oliver Powell

Anthony P Ingraham

John J Ritsko

Raymond Thomas Galasco

Thomas P Gall

Andrew Michael Seman

Michael Warner

Jaynal Abedin Molla

Jungihl Kim

George J Saxenmeyer, Jr

Jack A Varcoe

Kathleen L Covert

Ekkehard F Miersch

Owais Jamil

David R Baker

Thomas Gaudette

Peter Tho Nguyen

Donald Francis Canaperi

James Robert Wilcox

Delin Li

Richard A Schumacher

David Joseph Geoffroy

Tien Y Wu

Anne L Mcaleer

John A Grange

Solomon L Levine

Massimo Eugenio Ravelli

Dennis Castillo

Paula Lagattuta Tostado

Dexter Shih-Wei Pao

Jennette E Kingsley

Dinesh Sundararajan Kalakkad

Charles E Gasdik

Paul B Pickar

Fred G Benkley Iii

A method for manufacturing a flex inlay is provided. The method includes providing a flexible printed circuit having opposed surfaces. The method includes attaching components to a surface of the flexible printed circuit. The method includes applying a coverlay over at least one surface of the flexible printed circuit, wherein the coverlay is patterned to not cover any components attached to the surface of the flexible printed circuit. The coverlay at least in part forms an essentially planar surface of the flex inlay.

Flexible inlay and manufacturing method thereof

A sensor assembly comprises a rigid substrate with a circuit subassembly wrapped therearound. The circuit subassembly includes a flexible substrate with conductive traces and interconnects formed thereon, and when wrapped around the rigid substrate, the conductive traces may overlap one another so as to form capacitive sensor elements. The interconnects connect the conductive traces to one or more components, such as a printed circuit board attached to a portion of the flexible substrate. The sensor assembly maybe installed in an opening formed in a host device panel of a host device, such as a smart phone, with the sensor assembly optionally peripherally surrounded by a spacer frame, and covered by a cover element. The circuit subassembly may include a host connector tab for electrically connecting the sensor assembly to electrical components of a host device.

Electronic sensor supported on rigid substrate

A sensor assembly includes a flexible substrate with conductive traces formed on opposed sides of the substrate and oriented transversely to each other. The substrate is wrapped around a core so that the traces formed on opposed sides of a first part of the substrate form a first sensor surface on one surface of the core, and the traces formed on opposed sides of a second part of the substrate form a second sensor surface on an opposed surface of the core. The core may comprise an encapsulant overmolded onto the conductive traces on a surface of the first part of the substrate, and the second part of the substrate is folded over the encapsulant. The sensor assembly may include an integrated circuit disposed on the flexible substrate, wherein one or more of the conductive traces are electrically connected to each integrated circuit.

Double sided sensor module suitable for integration into electronic devices

A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other 'Internet of Things' (IOT) electronic device.

Configurable, encapsulated sensor module and method for making same

A plurality of molded cover members are manufactured by first singulating a single sheet of cover material, such as glass, into a plurality of separate, discrete cover members, placing the cover members in spaced-apart positions on a releaseable carrier, and applying a molded material to the perimeter of each cover member. The molded material can be applied by a blanket molding technique whereby gaps between adjacent cover members are filled, and then the cover members are singulated, leaving a portion of the cover material on the perimeter of each cover member, and then the singulated, molded cover members are released from the releasable carrier. Alternatively, the molded material is applied by a patterned molding technique whereby molding material is applied to the perimeter of each cover member without fully filling the gaps between adjacent cover members, and then the molded cover members are released from the releasable carrier.

Method of manufacturing a cover member suitable for a fingerprint sensor

A fingerprint sensor assembly includes a capacitive fingerprint sensor disposed beneath a thin layer of glass and a reinforcement layer of a material of relatively high dielectric constant bonded to the glass between the glass layer and the sensor.

Reinforcement panel for fingerprint sensor cover

Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

Electrical connector with electrical contacts protected by a layer of compressible material and method of making it

The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection.

Electrical connector and method of making it

A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

Layered metal structure for interconnect element

A method for making a reusable mold for forming a microelectronic element package. The method including the steps of removing material from portions of a base to form recesses in the base and then depositing a mask material on at least some portions of the base.

Method for making a microelectronic package using pre-patterned, reusable mold and method for making the mold

A microelectronic assembly includes a first microelectronic element having a contact bearing face and at least one contact accessible at the contact bearing face, and a second microelectronic element opposing the first microelectronic element, the second microelectronic element having a first surface including at least one lead extending over the first surface. The microelectronic assembly includes the first fusible material engaging the at least one contact of the first microelectronic element, and a second fusible material engaging the at least one lead, whereby one of the first and second fusible materials has a higher melting temperature and one of the first and second fusible materials has a lower melting temperature. The first and second microelectronic elements are juxtaposed with one another so that the first and second fusible materials are in substantial alignment with one another, with one of the first and second fusible materials in a liquid state and one of the first and second fusible materials in a solid state.

Assemblies for temporarily connecting microelectronic elements for testing and methods therefor

A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

Enhancements in framed sheet processing

A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

Microelectronic assemblies having low profile connections

A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

Connection component with peelable leads

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Los Gatos, CA, United States of America

David Noel Light