Nordson Corporation

Valu Engineering, Inc.

Graco Inc.

David N Padgett

Stuart J Ledingham

Mark S Meier

Philip P Maiorca

Christopher L Giusti

Stanley Cruz Aguilar

Brett Huey

Kyle Springer

Steve Majgier

Eric Austin

Alan Ray Lewis

Robert J Lind

Per Orla-Jensen

Methods of dispensing fluid are disclosed. A first applicator is positioned above a first dispense site at a first dispense region of a first electronic substrate by moving the first applicator using a primary positioner. A second applicator is simultaneously positioned above a first dispense site at a second dispense region of the first electronic substrate by moving the second applicator together with the first applicator using the primary positioner and moving the second applicator relative to the first applicator using a secondary positioner. It is then determined that the first or the second dispense region is misaligned relative to the other of the first or the second dispense region. Fluid is dispensed from the first applicator while moving the first applicator using the primary positioner to form a first fluid pattern at the first dispense region and fluid is simultaneously dispensed from the second applicator while moving the second applicator using the primary positioner and the secondary positioner.

Dual applicator fluid dispensing methods and systems

Systems and methods for two-component mixing in a jetting dispenser are provided herein. A jetting dispenser includes a fluid chamber having a first fluid inlet providing a first fluid and a second fluid inlet providing a second fluid, wherein the first fluid and the second fluid mix within the fluid chamber into a mixed fluid. A method for dispensing a mixed fluid from a dispenser having a fluid chamber in fluid communication with first and second fluid inlets is also provided. A first fluid is provided to the fluid chamber via the first fluid inlet and a second fluid is provided to the fluid chamber via the second fluid inlet. At least a portion of a valve element is moved relative to a valve seat to cause dynamic mixing of the first fluid and the second fluid within the fluid chamber to produce the mixed fluid that is dispensed.

Systems and methods for two-component mixing in a jetting dispenser

Methods for simultaneously dispensing a first fluid pattern at a first dispense region with a first applicator and a second fluid pattern at a second dispense region with a second applicator. The first and second applicators are moved toward their respective dispense regions with a positioner. While dispensing, the second applicator is moved relative to the first applicator in a direction or directions parallel to a first axis, a second axis, and/or a third axis, the axes being mutually orthogonal. The first dispense region may be provided with a unique first tilt and/or a unique first contour relative to the reference plane and along the third axis. Systems for dispensing fluid include a primary positioner supporting a first applicator, and a secondary positioner coupled to the primary positioner and supporting a second applicator and configured to move the second applicator relative to the first applicator.

Jetting devices and methods for dispensing a fluid material from a fluid supply. A jetting device includes a fluid module configured to be coupled with the fluid supply and to dispense the fluid material. The fluid module includes a valve seat and a valve element configured to move relative to the valve seat over a stroke length, and a valve stop configured to position the valve element relative to the valve seat for determining the stroke length. The jetting device further includes a drive module configured to actuate the fluid module and includes a drive pin configured to move the valve element toward the valve seat. The drive pin is configured to be rotated to cause rotation of the valve stop for adjustment of the stroke length. The drive pin may be rotated by a rotation device comprising a motor.

Jetting devices

Apparatus and methods for heating of one or more substrates with a plurality of independently controllable heating zones. Pressurized air is provided to each of a plurality of independently controlled heater blocks each including a heating element. The pressurized air is heated in the heater blocks and discharged towards one or more regions of the one or more substrates. The amount of power provided to the heating element in one of the heating blocks may be adjusted relative to the amount of power provided to the heating element in another of the heating blocks. The temperature of one heating zone may thereby be adjusted relative to other heating zones so that the temperature of different heating zones for the one or more substrates may be independently controlled. Heated air may be recovered from the heating zones and recycled. The pressurized air may be preheated by passing through a lift plate.

Air impingement heater

A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

Apparatus for vacuum encapsulation of semiconductor chip packages

The present invention provides a guide rail support bracket assembly for supporting a conveyor system guide rail through a support rod. The assembly includes a support bracket having a mounting segment configured to be mounted to a conveyor body. The support bracket is preferably formed by cutting and bending a generally flat metal plate. A support segment is connected at one end to the mounting segment and at another end, spaced from the mounting segment, to an angled clamping section. The support rod is clamped into the clamping section by an eyebolt that fits through a clamping hole formed in the angled clamping section. The eyebolt is drawn into the angled clamping section by a clamping knob.

Guide rail support bracket for conveyor system

A guide rail support bracket assembly for supporting a conveyor system guide rail through a support rod. The assembly includes a support bracket having a mounting segment configured for mounting to a conveyor body. In one aspect, the support bracket is formed by cutting and bending a generally flat metal plate. A support segment is connected to the mounting segment and, spaced from the mounting segment, to an angled clamping section. The support rod is clamped into the clamping section by an eyebolt that fits through a clamping hole formed in the angled clamping section. The eyebolt is drawn into the angled clamping section by a clamping knob. In certain aspects, an extension segment is interposed between the mounting and the support segments to space the support segment further from a conveyor body. In other aspects, the support bracket and clamping sections are separate pieces pivotably joined by a fastener.

Guide rail support bracket assembly for conveyor system

Tool for dispensing adhesives, sealants, and underfill materials

A multi-chamber vacuum encapsulation system for encapsulation of semiconductor chip packages. The encapsulation system includes a dispense chamber, an inlet chamber mounted adjacent an inlet end of the dispense chamber, and an outlet chamber mounted adjacent an outlet end of the dispense chamber. The dispense chamber includes a material dispensing head for dispensing encapsulant material about the peripheral edges of chip packages under at least partial vacuum of the dispense chamber. A transport mechanism is provided in the dispense chamber for moving the chip packages between the inlet and outlet ends of the chamber. During the encapsulation process, the dispense chamber remains evacuated at all times while the smaller inlet and outlet chambers are evacuated and vented in a controlled manner to allow transfer of chip packages to and from the dispense chamber without venting of the dispense chamber to atmosphere. After the dispense cycle in the dispense chamber is completed, the chip packages are transferred to the outlet chamber which is then vented to atmosphere at a controlled rate to complete the encapsulation process. Methods of vacuum encapsulating semiconductor chip packages are also disclosed.

Growing community of inventors

Carlsbad, CA, United States of America

David N Padgett