Eastman-kodak Company

David N Bull

Edward J Ozimek

Edward Carnall, Jr

Terry Tarn

The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates. Once the device is bonded to the terminal board, the temperature the assembly is subject to can be higher than the temperature used for the bonding operation without causing any harm to the bond.

Bonding of solid state device to terminal board

A method and apparatus for forming a solid preform body of an amalgam from a thin layer of the amalgam comprises a base plate on which the amalgam in liquid form is spread into a thin layer. The amalgam comprises a mixture of a liquid metal and a powdered metal. A first temperature is applied to the amalgam layer through the base plate. The first temperature may be lower than the melting temperature of the liquid metal in the amalgam to form a frozen solid layer of the amalgam, or may be above the melting temperature of the liquid metal to maintain the amalgam layer in liquid form. A second temperature is applied to a portion of the amalgam layer which is to form the preform body. If the first temperature is below the melting temperature of the liquid metal, the second temperature is above the melting temperature of the liquid metal to form a molten zone in the amalgam layer along the edge of the preform body so as to permit the body to be separated from the remaining portion of the amalgam layer. If the first temperature is above the melting temperature of the liquid metal, the second temperature is below the melting temperature so as to form a frozen solid portion in the amalgam layer which can be removed from the amalgam layer.

Method and apparatus for forming amalgam preform

Method and apparatus are disclosed for mounting a second optical component on a first optical component using a spacer layer for forming a controlled gap between the two components. In a preferred embodiment, a CCD sensor is formed having a non-active area and an active area for detecting lightwaves. A spacer layer of an epoxy or similar material is formed on at least a portion of the non-active area of the sensor. A fiber optic faceplate is mounted on the spacer layer to form the controlled gap between the active area of the CCD sensor and the faceplate. The fiber optic faceplate has a predetermined index of refraction for passing lightwaves towards the active area of the sensor. A coupling compound, having an index of refraction which substantially matches that of the faceplate, is used to fill the controlled gap between the faceplate and the active area of the sensor.

Fiber optic faceplates and method of mounting same

A technique for sawing substrates on a chuck wherein the substrate is secured to a layer of a first sawing tape, and is placed on the major surface of a chuck with a second tape therebetween. The second tape comprises both a first major surface with a low surface tension effect that is in contact with the major surface of the chuck, and a multitude of perforations or pinholes therein. Vacuum is applied to both the channels in the major surface of the chuck and the pinholes in the second tape, to securely hole the substrate to the chuck during the sawing of the substrate. When the sawing is completed, the vacuum is removed and either atmospheric pressure or pressurized air is applied to the channels of the chuck, and the combination of the substrate, first sawing tape and second tape are easily removable because of the low surface tension effect of the first major surface of the second tape with the major surface of the chuck.

Sawing method for substrate cutting operations

A plurality of semiconductor chips are first attached to a transparent mask by placing indica marks on the mask and then viewing the chips through the mask and aligning them to the indica marks. The chips, which are held on a vacuum pedestal, are then brought into contact with the mask and a temporary adhesive layer holds the chips to the mask. The vacuum is then released. The mask with the chips attached thereto is then aligned to a printed circuit (wiring) board having indica marks thereon by viewing through the mask and moving the chips and printed circuit board together until they contact each other. A permanent adhesive layer holds the chips to the printed circuit board. The temporary adhesive layer is then dissolved and removed from the chips.

Growing community of inventors

Rochester, NY, United States of America

David N Bull