Seagate Technology Incorporated

Xyratex Technology Limited

David Michael Davis

Alexander Carl Worrall

Odie Killen

Timothy P E Williams

Richard Charles Alexander Pitwon

Gary Edward Webb

Alan John Westbury

Richard C A Pitwon

Kevin Lee Van Pelt

Odie Banks Killen, Jr

Robert Walker

Graham Collins

Paul Foisy

David Dick Anderson, Jr

Michael Easton

Neil A Edmunds

Christopher J Nother

Timothy Groom

Myles Edward Richard Spence

Christopher J Girard

Alan Westrop

A system, apparatus, and method including a cable apparatus that is configured to be physically coupled to a printed circuit board. The cable apparatus includes a cable connector including at least one prong configured to be coupled within an aperture of the printed circuit board and an opening configured to receive an additional connector. The cable apparatus also includes a plurality of flexible cables coupled to the cable connector. Connecting portions of each of the plurality of flexible cables positioned within the opening of the receiving housing and configured to be operably coupled to the additional connector. The at least one prong does not transmit a signal into the printed circuit board and is configured to be press-fit within the aperture of the printed circuit board.

Printed circuit board mounted cable apparatus and methods thereof

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

Configuration element for printed circuit board assemblies

A system includes a first optical communication interface and a second optical communication interface optically coupled via a free-space communication channel. The interfaces are spaced at variable distances. Each interface includes an optical source to provide a beam of electromagnetic energy and an optical receiver to receive the beam to bi-directionally communicate with the other interface via the channel. The first optical communication interface may be coupled to a sub-chassis. The second optical communication interface may be coupled to a device frame. The device frame may be movably coupled to the chassis. Communication may utilize multi-input, multi-output processing configured by a calibration matrix. A shutter may be positioned to receive the beam or be positioned clear of the beam depending on the distance between the interfaces.

Optical data communication over variable distances

A system includes an enclosure with a device space having a layer of active devices arranged into rows and adjacent cooling channels and an inlet partition having apertures aligned to the cooling channels defining a supply plenum. In a method of use, cooling fluid, such as air, is transferred from the supply plenum to the cooling channels to concurrently cool the layer of active devices and may provide substantially the same temperature and flow of cooling fluid to each row of active devices. Active devices may include storage devices. The supply plenum may include elongate ducts to encourage uniform cooling along a row. The supply plenum may also include a duct partition or more than one supply plenum to encourage uniform cooling among the rows. One or more fans may provide pressurized cooling fluid in the supply plenum space.

Rack enclosure cooling systems and related methods

An enclosure has a sidewall with a step that results in an upper part of the sidewall extending over a slide mounting region. A backplane is located at a base of the enclosure and is configured to receive a plurality of data storage drives. A circuit carrier extends from the backplane to the step in the side of the enclosure. The circuit carrier has one or more connectors proximate an upper surface of the step and is configured to receive one or more expansion modules that expand a functionality of the backplane.

Storage array enclosure having sidewall step for use with expansion module

The disclosed technology provides an enclosure system for computing equipment and a method for manufacturing an enclosure system, which includes a front enclosure base configured to secure a plurality of tray modules, each of the plurality of tray modules comprising a printed circuit board to connect a plurality of electronic components and being connected at a rear end to a connectivity midplane. The front enclosure base has a front end taller than the rear end such that the front end is configured to structurally support the plurality of tray modules and the rear end allows connecting rear faces of each of the plurality of tray modules to the connectivity midplane.

Enclosure system for computing equipment

Apparatus and method for cooling a power supply unit in a storage system. In some embodiments, a storage system includes a first section for receiving a plurality of storage media, a second section having a power supply unit, and a plenum arranged in communication with the first and second sections. The power supply unit has an inlet for receiving air, an outlet for exhausting air and an airflow generator which generates airflow therethrough, where the inlet and the outlet are in fluidic communication with the plenum.

Storage system with cross flow cooling of power supply unit

The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, comprising a plurality of baffles or airflow redirection modules, and a controller configured to control an orientation of one or more of the plurality of baffles or airflow redirection modules for redirection of airflow distribution within the computing system enclosure based on a determined computing system enclosure profile. In another implementation, a method includes monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of one or more baffles or airflow redirection modules in the computing system based on results of the monitoring operation for redirection of airflow distribution.

Computing system enclosure airflow distribution management

Method and apparatus for populating and operating a storage enclosure carrier with multiple hot swappable storage devices. In some embodiments, a carrier housing having length, width and thickness dimensions is adapted to accommodate at least one hard disc drive (HDD) having a selected HDD form factor and configured for engagement in a storage enclosure housing. A plurality of solid state drives (SSDs) each conforming to a selected SSD form factor are supported within the length, width and thickness dimensions of the carrier housing. Each of the SSDs is individually retractable from a front facing portion of the carrier housing without removal of the carrier housing from the storage enclosure housing.

Storage enclosure carrier which supports multiple storage devices

Apparatus and method for providing a non-volatile fault indication in a multi-device storage enclosure. In some embodiments, a storage enclosure includes a plurality of storage devices housed within a storage enclosure housing. A non-volatile display element is arranged to provide a persistent display of fault information relating to a component of the storage enclosure after power is removed from the display element.

Non-volatile fault indication in a storage enclosure

The invention provides a storage system comprising a solid state storage carrier sized to correspond to a defined storage form factor and to include a support printed circuit board (PCB) having arranged thereon a plurality of solid state storage devices. The storage system can include a storage enclosure including a midplane and at least one slot on an end of the storage enclosure, sized to receive a solid state storage carrier for connection with the midplane in the storage enclosure. The storage system can also include at least one midplane connector located on the midplane, wherein the at least one midplane connector is configured to mate with at least one form factor connector on an end of the solid state storage carrier.

Solid state storage system

The disclosed technology provides systems and methods for an enclosure system with optimized internal dynamically controllable airflow distribution. The systems include a computing system enclosure, and an electroactive film adhered to a surface of the computing system enclosure and configured to redirect airflow distribution in the computing system enclosure. In another implementation, a method monitoring airflow distribution within a computing system enclosure with a plurality of sensors, and controlling an orientation of a programmable microstructure in an electroactive film adhered to a surface of the computing system enclosure based on results of the monitoring operation. In yet another implementation, the disclosed technology includes bimetallic baffles configured for utilization in a computing system enclosure to redirect airflow distribution within the computing system enclosure.

Computing system enclosure airflow management

A data storage system and a method of cooling the data storage system are presented. The data storage system includes: an enclosure; one or more drawer structures disposed within the enclosure, wherein at least one of the drawer structures is configured to receive one or more electronic devices; and one or more temperature control elements positioned adjacent to the bottom of the at least one drawer structure, wherein at least one of the temperature control elements is arranged in use to thermally communicate with at least one of the electronic devices.

Data storage system and a method of cooling a data storage system

Storage systems, carriers, enclosures and support PCBs connecting to a first storage device of a first form factor such as a hard disc drive (HDD), a dongle within a storage carrier coupled to the first storage device, and a second storage device such as a solid-state drive (SSD) coupled to the dongle having a second form factor different than or smaller than the first form factor.

Growing community of inventors

Portsmouth, United Kingdom

David Michael Davis