Shipley Company LLC

David Merricks

James G Shelnut

Martin William Bayes

Mark Lefebvre

Denis Morrissey

Donald E Storjohann

Jeffrey M Calvert

Eugene N Step

Charles R Shipley

Leon Barstad

Oleh B Dutkewych

Martin T Goosey

Narinder Singh Bains

Robert A Schetty, Iii

Disclosed are methods for depositing a copper seed layer on a substrate having a conductive layer. Such methods are particularly suitable for depositing a copper seed layer on a substrate having small apertures, and preferably very small apertures.

Seed layer deposition

Disclosed are methods for repairing or enhancing discontinuous metal seed layers prior to subsequent metallization during the manufacture of electronic devices. Such repair methods do not require the use of a second electroplating bath.

Seed layer

Disclosed are methods for repairing seed layers prior to subsequent metallization during the manufacture of electronic devices.

Seed layer repair bath

Disclosed are catalyst compositions suitable for depositing electroless metal seed layers and for enhancing discontinuous seed layers. Also disclosed are methods of depositing electroless seed layers and enhancing discontinuous seed layers.

Plating catalysts

Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Seed layer repair method

Growing community of inventors

Coventry, United Kingdom

David Merricks