Rockley Photonics Limited

David Mccann

Chia-Te Chou

Shuhe Li

Haydn Frederick Jones

Brett Sawyer

Alexander Gondarenko

William Vis

Alexander Fast

An assembly. In some embodiments, the assembly includes a first semiconductor chip, a substrate, and a first alignment element. The alignment of the first semiconductor chip and the substrate may be determined at least in part by engagement of the first alignment element with a first recessed alignment feature, in a surface of the first semiconductor chip.

Integrated self-aligned assembly

An optical assembly () for use in a wearable device is provided, the assembly () comprising: a prism (), a photonic integrated chip, PIC (), a substrate layer (), and a lid (); wherein the PIC () is mounted onto the substrate layer (); the prism () comprising: (i) a first input/output surface () optically coupled to the PIC (), and (ii) a second input/output surface () optically coupled to the lid (), the second input/output surface () orientated perpendicularly to the first input/output surface (), and wherein the prism () provides an optical path and reflects a percentage of light from the first input/output surface () to the second input/output surface (). Methods of manufacturing such an optical assembly are also provided.

Optical assemblies comprising a prism

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Pasadena, CA, United States of America

David Mccann